Aptek 2100-A/B Urethane Encapsulant and/or Potting Compound

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Aptek 2100-A/B Urethane Encapsulant and/or Potting Compound
Categories:	Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive
Material Notes:	General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space applications. Part A is a cloudy, unfilled polyol resin. Part B is a clear/hazy yellow organic isocyanate. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Original Value	Comments

Density	0.910 g/cc	A Component; ASTM D1475
	1.23 g/cc	B Component; ASTM D1475
Moisture Absorption at Equilibrium	0.18 %	Cured property; ASTM D570
Viscosity	50 cP	B Component; ASTM D1824
	8000 cP	A Component; ASTM D1824
Outgassing - Total Mass Loss	0.38 %	Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material	0.030 %	Cured property; at 10E-6 torr; ASTM E595

Mechanical Properties	Original Value	Comments
Hardness, Shore A	50 - 60	Cured property; ASTM D2240
Tensile Strength, Ultimate	480 psi	Cured property; ASTM D412
Elongation at Break	325 %	Cured property; ASTM D412
Modulus of Elasticity	0.750 ksi	Cured property; ASTM D412
Adhesive Bond Strength	525 psi	Al-to-Al Lap Shear; Cured property; ASTM D1002

Electrical Properties	Original Value	Comments
Volume Resistivity	8.80e+15 ohm-cm	Cured property; ASTM D257
Dielectric Constant	3.2 @Frequency 1000 Hz	Cured property; ASTM D150
Dielectric Strength	370 V/mil @Thickness 12.7 mm	Cured; ASTM D149
	>= 2000 V/mil @Thickness 0.127 mm	Cured; ASTM D149
Dissipation Factor	0.024 @Frequency 1000 Hz	Cured property; ASTM D150

Thermal Properties	Original Value	Comments
CTE, linear	67.0 µm/m-°C @Temperature 20.0 °C	Cured property; alpha 1
	220 µm/m-°C @Temperature 20.0 °C	Cured property; alpha 2
Thermal Conductivity	0.000420 cal cm/sec-cm²-°C	COLORA
Glass Transition Temp, Tg	-65.0 °C	Cured property; JMTP P200
Flash Point	>= 150 °C	B Component; ASTM D92
	>= 200 °C	A Component; ASTM D92

Processing Properties	Original Value	Comments
Processing Temperature	80.0 °C	Cure 8 hrs.
	100 °C	Cure 4 hrs.

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