Rogers Corporation RT/duroid® 6035HTC Ceramic Filled PTFE Composite, High Power RF and Microwave

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Rogers Corporation RT/duroid® 6035HTC Ceramic Filled PTFE Composite, High Power RF and Microwave
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE); Polytetrafluoroethylene (PTFE), Glass Filled, Molded
Material Notes:	Features & Benefits: High thermal conductivity - Improved dielectric heat dissipation, enabling lower operating temperatures for high power applications Low loss tangent - Excellent high frequency performance Thermally stable low profile and reverse treated copper foil - Lower insertion loss and excellent thermal stability of traces Advanced filler system - Improved drillability and extended tools compared to alumina-containing circuit materials Lead-free process compatible ED and reverse treat copper foil Applications: High power RF and microwave amplifiers Power amplifiers, couplers, filters, combiners, power dividers Information provided by Rogers Corporation.
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Physical Properties	Original Value	Comments

Density	2.20 g/cc	ASTM D792
Moisture Absorption at Equilibrium	0.060 %	D24/23; IPC-TM-650 2.6.2.1; ASTM D570
Thickness	10.0 - 60.0 mil	Range of Standard Thicknesses

Mechanical Properties	Original Value	Comments
Tensile Modulus	244 ksi	TD; 40 hours; 50%RH; ASTM D638
	329 ksi	MD; 40 hours; 50%RH; ASTM D638
Peel Strength	7.90 pli @Temperature 288 °C, Time 20.0 sec	IPC-TM-650 2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+14 ohm-cm	Condition A; Z direction; IPC 2.5.17.1
Surface Resistance	1.00e+14 ohm	Condition A; Z direction; IPC 2.5.17.1
Dielectric Constant	3.45 - 3.55 @Frequency 1e+10 Hz	Z direction; Process; IPC-TM-650 2.5.5.5
	3.6 @Frequency 8.00e+9 - 4.00e+10 Hz	Z direction; Design; Differential Phase Length Method
Dissipation Factor	0.0013 @Frequency 1e+10 Hz	Z direction; IPC-TM-650, 2.5.5.5

Thermal Properties	Original Value	Comments
CTE, linear	19.0 µm/m-°C @Temperature -55.0 - 288 °C	X-, Y-Direction; ASTM D3386
	39.0 µm/m-°C @Temperature -55.0 - 288 °C	Z-Direction; ASTM D3386
Thermal Conductivity	1.44 W/m-K @Temperature 80.0 °C	ASTM C518
Flammability, UL94	V-0	anticipated

Descriptive Properties
Dimensional Stability	0.07 mm/m	IPC-TM-650 2.4.3.8; X, Y direction; after etch, +E/150
	0.07 mm/m	IPC-TM-650 2.4.3.9; X, Y direction; after etch, +E2/150
Thermal Coefficient of Dielectric Constant	-66 ppm/°C	mod IPC-TM-650, 2.5.5.5; Z direction; -50°C to 150°C

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PROGA978 / 138418

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