Cookson Group STAYCHIP® 3082 High Reliability Flip Chip Underfill, Low CTE

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Cookson Group STAYCHIP® 3082 High Reliability Flip Chip Underfill, Low CTE (discontinued **)
Categories:	Polymer; Adhesive; Thermoset
Material Notes:	STAYCHIP™ 3082 is a highly filled, high reliability capillary underfill designed for high performance applications. This material provides superior adhesion to common solder-mask and die passivations, even after exposure to elevated heat, pressure, and humidity for superior JEDEC performance. This fast flow underfill was formulated for penetration of gaps below 1 mil. When fully cured, the material displays excellent reliability in thermal cycling performance. It is easily dispensed and exhibits low moisture absorption for improved JEDEC performance. Features: Excellent reliability in thermal cycling Excellent Reliability in JEDEC testing Low CTE High Tg Exceptional adhesion (even after exposure to high humidity, pressure, and temperature) Fast, efficient flow properties Small particle size filler for use on fine pitch array packages High filler loading while maintaining fast flow properties Information provided by Cookson Electronics
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Physical Properties	Original Value	Comments

Specific Gravity	1.57 g/cc	ASTM D 792-00
Filler Content	52 %
Moisture Absorption at Equilibrium	<= 1.0 %	24 hour boil; ASTM D5229/D 5229M-92 (1998) e1. D 570-98
Particle Size	<= 10 µm
Brookfield Viscosity	4000 cP	Brookfield #51 at 10 RPM; ASTM D2196-99
Storage Temperature	<= -40.0 °C

Mechanical Properties	Original Value	Comments
Hardness, Shore D	>= 92	ASTM D 2240-03
Adhesive Bond Strength	9.00 MPa	Shear strength to polyimide passivated Die, 75 micron gap, at 200°C; DIN EN 60749-20
	77.0 MPa	Shear strength to polyimide passivated Die, 75 micron gap, at 25°C; DIN EN 60749-19

Electrical Properties	Original Value	Comments
Dielectric Constant	3.4 @Frequency 1000 - 100000 Hz
Dissipation Factor	0.0020 @Frequency 1000 Hz
	0.0030 @Frequency 10000 Hz
	0.0080 @Frequency 100000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	38.0 µm/m-°C @Temperature 20.0 °C	Alpha 1
	141 µm/m-°C @Temperature 20.0 °C	Alpha 2
Glass Transition Temp, Tg	136 °C	By DSC; ASTM D3418-99
Flash Point	>= 200 °C	ASTM D 93-02

Processing Properties	Original Value	Comments
Pot Life	1920 min @Temperature 23.0 °C	Time to double viscosity; ISO 10364:1993
Shelf Life	6.00 Month @Temperature -40.0 °C

Descriptive Properties
Appearance	Black
Chemical Type	Epoxy/Anhydride
Extractable Ionic Content, Chloride (Cl)	<10 ppm
Extractable Ionic Content, Potassium (K)	<2 ppm
Extractable Ionic Content, Sodium (Na)	<2 ppm
Storage Modulus	4.8 GPa	ASTM D5023-01

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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