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Master Bond adhesives

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Elantas Conap FR-1610 / EA-039 Conapoxy® Resin / Conacure® Hardener
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes:
Epoxy Potting and Encapsulating Systems for Electronic Applications
High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.

Cytec (Conap) FR-1610 / EA-039 Conapoxy® Resin / Conacure® Hardener
A filled, high performance flexible epoxy casting system. Little change in hardness after aging at 155°C. Recommended for potting and encapsulating transformers, coils and similar electrical devices.
  • Mix Ratio, Resin/Hardener (by weight): 100/25
Cure Type: Elevated Temperature

Information provided by Cytec, subsequently acquired by Elantas.

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Physical PropertiesOriginal ValueComments
Viscosity 11000 cP
@Temperature 25.0 °C
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 82
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity <= 2.10e+14 ohm-cm
Dielectric Constant 3.8
@Frequency 1000 Hz
Dielectric Strength 380 V/mil
Dissipation Factor 0.012
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 155 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 hour
@Temperature 140 °C
Pot Life 180 min
@Temperature 120 °C
100 grams
 480 min
@Temperature 25.0 °C
100 grams

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