Copper, UNS C65400, H14 Temper, Flat Products

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Copper, UNS C65400, H14 Temper, Flat Products
Categories:	Metal; Nonferrous Metal; Copper Alloy
Material Notes:	Temper: Super Spring Fabrication Properties: Excellent Suitability – Gas Shielded Arc Welding, Spot Weld, Seam Weld, Butt Weld, Capacity for Being Cold Worked, Capacity for Being Hot Formed; Good Suitability – Soldering, Brazing, Oxyacetylene Welding; Fair Suitability – Coated Metal Arc Welding Common Fabrication Processes: Bending; Blanking; Piercing Typical uses: Contact springs; Electronic Connectors; Wiring Devices Applicable Specifications: Bar – ASTM B98/B98M; Sheet, Strip, Roller Bar & Plate – ASTM B96/B96M, for Pressure Vessels & General Purpose ASME SB96; Strip – ASTM B888/B88M
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Physical Properties	Metric	English	Comments

Density	8.55 g/cc	0.309 lb/in³

Mechanical Properties	Metric	English	Comments
Hardness, Rockwell B	102 @Thickness 1.02 mm	102 @Thickness 0.0400 in
Hardness, Rockwell 30T	82 @Thickness 1.02 mm	82 @Thickness 0.0400 in
Tensile Strength	945 MPa @Thickness 1.02 mm	137000 psi @Thickness 0.0400 in
Tensile Strength, Yield	876 MPa @Thickness 1.02 mm	127000 psi @Thickness 0.0400 in	0.2% Offset
Elongation at Break	1.0 % @Thickness 1.02 mm	1.0 % @Thickness 0.0400 in
Tensile Modulus	117 GPa	17000 ksi
Machinability	30 %	30 %

Electrical Properties	Metric	English	Comments
Electrical Resistivity	0.0000250 ohm-cm	0.0000250 ohm-cm	7% IACS

Thermal Properties	Metric	English	Comments
CTE, linear	17.5 µm/m-°C @Temperature 20.0 - 100 °C	9.70 µin/in-°F @Temperature 68.0 - 212 °F
	17.5 µm/m-°C @Temperature 20.0 - 200 °C	9.70 µin/in-°F @Temperature 68.0 - 392 °F
	17.5 µm/m-°C @Temperature 20.0 - 300 °C	9.70 µin/in-°F @Temperature 68.0 - 572 °F
Thermal Conductivity	3.03 W/m-K	21.0 BTU-in/hr-ft²-°F
Melting Point	957.2 - 1018 °C	1755 - 1865 °F
Solidus	957.2 °C	1755 °F
Liquidus	1018 °C	1865 °F
Annealing Point	399 - 593 °C	750 - 1100 °F

Component Elements Properties	Metric	English	Comments
Chromium, Cr	0.010 - 0.12 %	0.010 - 0.12 %
Copper, Cu	94 - 96.1 %	94 - 96.1 %	As Balance
Lead, Pb	<= 0.050 %	<= 0.050 %
Silicon, Si	2.7 - 3.4 %	2.7 - 3.4 %
Tin, Sn	1.2 - 1.9 %	1.2 - 1.9 %
Zinc, Zn	<= 0.50 %	<= 0.50 %

Descriptive Properties
US EPA Registered Antimicrobial	No

References for this datasheet.

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MC65400x2 / 293058

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