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Ensinger PEI

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Henkel Loctite® ECCOBOND UF 8830S Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Grey paste

Cure: Heat cure

Product Benefits:

  • High purity
  • High TG, low CTE
  • Improved toughness
  • Good flow with self filleting
  • Long staging time and worklife
  • 260ºC reflow capability for Pb-free, low-k applications
Application: Underfill

Typical Package Application: Flip Chip BGA

LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.60 g/cc
Brookfield Viscosity 22120 cPSpindle 51, Speed 5 rpm
 
Mechanical PropertiesOriginal ValueComments
Tensile Modulus 11500 MPaStorage, Cured, DMA
 
Thermal PropertiesOriginal ValueComments
CTE, linear 25.0 µm/m-°CCured, Below Tg
 100 µm/m-°CCured, Above Tg
Glass Transition Temp, Tg 118 °CCured, by TMA
 126.5 °CCured, by DMA
 
Processing PropertiesOriginal ValueComments
Cure Time 30.0 minramp from 25°C to 150°C, hold 2hrs at 150°C
Working Life >= 24.0 hourWorklife, 100% increase in viscosity
Shelf Life 12.0 Month
@Temperature -40.0 °C
 
Descriptive Properties
Thixotropic Index0.85Uncured

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PLOCT5098 / 255309

Proto3000 – 3D Engineering Solutions

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