Henkel Loctite® ABLESTIK ABP 8064T Adhesive

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Henkel Loctite® ABLESTIK ABP 8064T Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver Cure: Heat Cure Product Benefits: High thermal conductivity High electrical conductivity Medium modulus Low outgassing Stable at high temperatures Good reliability performance Soft solder replacement Use for wide range of package sizes Application: Die attach Typical Package Application: QFP, High power devices LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	12000 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	1280 MPa @Temperature 250 °C	Cured, DMTA
	5260 MPa @Temperature 25.0 °C	Cured, DMTA

Electrical Properties	Original Value	Comments
Volume Resistivity	0.000020 ohm-cm

Thermal Properties	Original Value	Comments
CTE, linear	47.0 µm/m-°C	Cured, alpha1
	136 µm/m-°C	Cured, alpha2
Thermal Conductivity	22.0 W/m-K	Cured
Glass Transition Temp, Tg	44.5 °C	Cured, by TMA

Processing Properties	Original Value	Comments
Cure Time	60.0 min	ramp from 25°C to 180°C, hold 60 mins at 180°C in N2 oven
	60.0 min	ramp from 25°C to 140°C, hold 60 mins at 140°C in N2 oven, Alternative Cure Schedule
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
Shear Strength	12.18	Die, 3 X 3 mm (120 x 120 mil) Si die on PPF LF, @ 25ºC
	12.19	Die, 5 X 5 mm (200 x 200 mil) Si die on PPF LF, @ 260ºC
	18.54	Die, 8 X 8 mm (300 x 300 mil)Si die on PPF LF, @ 260ºC
	5.6	Die, 3 X 3 mm (120 x 120 mil) Si die on PPF LF, @ 260ºC
Thixotropic Index	5.8	Uncured, 0.5/5 rpm

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PLOCT5069 / 255280

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