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Ensinger PEI

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Parker Chomerics CHO-BOND® 589-29 Conductive Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Low cost, highly conductive adhesive system which combines the strong adhesion characteristics of an epoxy with the superior conductivity of silver. CHO-BOND 589-29 adhesive meets the most exacting electrical requirements without the high temperatures, fluxes and expensive preparatory techniques usually required for conventional solder systems.

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.20 - 2.80 g/cc
Solids Content 100 %
Thickness 10.0 milRecommended
 
Mechanical PropertiesOriginal ValueComments
Shear Strength >= 650 psi
 9.66 MPa
@Temperature 116 °C,
Time 900 sec
Lap
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 0.050 ohm-cmR.T. cure
 <= 0.0020 ohm-cm
@Temperature 116 °C,
Time 900 sec
DC
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 125 °C
Minimum Service Temperature, Air -55.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 0.250 hour
@Temperature 116 °C
 24.0 hour
@Temperature 24.0 °C
Shelf Life 9.00 Month
 
Descriptive Properties
BinderEpoxy
ColorSilver
ConsistencyThin Paste
Coverage156.1 cm2/g
FillerAG
Mix Ratio7 to 100
Work Life0.5 hr

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

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