Henkel Loctite® ABLESTIK ABP 2035SCR Adhesive

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Henkel Loctite® ABLESTIK ABP 2035SCR Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Red Cure: Heat cure Product Benefits: One component Low stress Snap curable Low cure temperature Good dispense behavior Compatible for use with encapsulant material Application: Die attach Filler Type Silica Typical Package Application: Smart Card LOCTITE ABLESTIK ABP 2035SCR non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Brookfield Viscosity	9830 cP	Uncured, CP51, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	70.0 MPa @Temperature 250 °C	Cured, DMA
	80.0 MPa @Temperature 100 °C	Cured, DMA
	1500 MPa @Temperature 25.0 °C	Cured, DMA

Thermal Properties	Original Value	Comments
CTE, linear	50.0 µm/m-°C	Cured, Below Tg
	135 µm/m-°C	Cured, Above Tg
Thermal Conductivity	1.00 W/m-K
Glass Transition Temp, Tg	118 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	2.00 min @Temperature 120 °C
	30.0 min @Temperature 100 °C	Alternative Cure Schedule
	60.0 min @Temperature 80.0 °C	Alternative Cure Schedule
Working Life	24.0 hour
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
Shear Strength	10 kg-f	Die, 2 x 2 mm die size, Si die on FR4
	19.5 kg-f	Die, 3 x 3 mm die size, Si die on Cu
	20 kg-f	Die, 3 x 3 mm die size, Si die on Ni
	21 kg-f	Die, 3 x 3 mm die size, Si die on Ag
	21.5 kg-f	Die, 3 x 3 mm die size, Si die on BGA
Thixotropic Index	4	Uncured, 0.5/5 rpm

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PLOCT5038 / 255249

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