Rogers Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate

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Rogers Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:	CuClad 233 uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties. Cross Plied Woven Fiberglass, alternating plies are oriented 90° to each other High PTFE to Glass Ratio Better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates Benefits: Electrical and Mechanical isotropy in the X-Y Plane Extremely Low Loss Well Suited for Er Sensitive Circuits Typical Applications: Military Electronics (Radars, ECM, ESM) Microwave Components (Filters, Couplers, LNAs, etc.) Information provided by Arlon Materials for Electronics (MED); now a part of Rogers Corporation.
Vendors:	Arlon Materials for Electronics (MED) is a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of printed circuit board (PCB) applications and in several distinctive markets. Click here to view all available suppliers for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
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Physical Properties	Original Value	Comments

Density	2.26 g/cc	ASTM D792 Method A
Water Absorption	0.020 %	IPC TM-650 2.6.2.2
Outgassing - Total Mass Loss	0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	Water Vapor Recovered; NASA SP-R-0022A
	0.010 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	NASA SP-R-0022A
Collected Volatile Condensable Material	0.010 % @Pressure <=1.33e-10 MPa, Temperature 125 °C	NASA SP-R-0022A

Mechanical Properties	Original Value	Comments
Tensile Strength	9800 psi	Cross; ASTM D882
	10300 psi	Machine; ASTM D882
Modulus of Elasticity	414 ksi	Cross; ASTM D638
	510 ksi	Machine; ASTM D638
Flexural Modulus	>= 371 ksi	ASTM D790
Compressive Modulus	276 ksi	ASTM D695
Peel Strength	14.0 pli	After Thermal Stress; IPC TM-650 2.4.8

Electrical Properties	Original Value	Comments
Volume Resistivity	8.00e+14 ohm-cm	C96/35/90; IPC TM-650 2.5.17.1
Surface Resistance	2.40e+12 ohm	C96/35/90; IPC TM-650 2.5.17.1
Dielectric Constant	2.33 @Frequency 1e+6 Hz	C23/50; IPC TM-650 2.5.5.3
	2.33 @Frequency 1e+10 Hz	C23/50; IPC TM-650 2.5.5.5
Dielectric Breakdown	>= 45000 V	D48/50; ASTM D149
Dissipation Factor	0.0013 @Frequency 1e+10 Hz	C23/50; IPC TM-650 2.5.5.5
Arc Resistance	>= 180 sec	D48/50; ASTM D495

Thermal Properties	Original Value	Comments
CTE, linear	23.0 µm/m-°C @Temperature 0.000 - 100 °C	x direction; IPC TM-650 2.4.24
	24.0 µm/m-°C @Temperature 0.000 - 100 °C	y direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow	194 µm/m-°C @Temperature 0.000 - 100 °C	z direction; IPC TM-650 2.4.24
Thermal Conductivity	0.258 W/m-K @Temperature 100 °C	ASTM E1225
Flammability, UL94	V-0	Vertical Burn

Descriptive Properties
Temperature Coefficient of Dielectric (ppm/°C)	-171	IPC TM-650 2.5.5.5 (-10 - 140°C)

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