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Chemically Resistant adhesives

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Lord Adhesives Circalok™ 6056 Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: LORD Circalok™ 6056 A/B encapsulant is a black, two-component, room temperature curing epoxy encapsulating compound featuring long pot life, convenient mix ratio and good dielectric properties.

All information provided by Lord.

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Physical PropertiesOriginal ValueComments
Density >= 7.96 lb/galCircalok 6056 B
 >= 14.36 lb/galCircalok 6056 A
Viscosity 1200 cP
@Temperature 25.0 °C
6056 Part B
 120000 cP
@Temperature 25.0 °C
6056 Part A
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 65cured
Tensile Strength 6000 psicured
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 8.60e+13 ohm-cmcured
Dielectric Constant 4.7
@Frequency 60.0 Hz,
Temperature 25.0 °C
Dielectric Strength 390 V/milcured
Dissipation Factor 0.0035
@Frequency 60 Hz,
Temperature 25.0 °C
 
Thermal PropertiesOriginal ValueComments
CTE, linear 50.0 µm/m-°Ccured
Thermal Conductivity 0.865 W/m-Kcured
Maximum Service Temperature, Air 105 °CRecommended Continual
 135 °CRecommended Intermittent
 
Processing PropertiesOriginal ValueComments
Cure Time 24.0 hour
@Temperature 25.0 °C
or 2 hours at 60C
Pot Life 30.0 min
@Temperature 25.0 °C
in 100 g mass
Shelf Life 6.00 Montheach component, from date of manufacture when stored in original, unopened container
 
Descriptive Properties
AppearanceAmber SyrupCircalok 6056 B
 Black SyrupCircalok 6056 A
Mix Ratio100 parts A to 29 parts Bby weight
 2 parts A to 1 part Bby volume

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PLORD9242 / 232598

Chemically Resistant adhesives

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