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Eastman Amphora™ AM1800 3D Polymer
Categories: Polymer; 3D Printing/Additive Manufacturing Polymer

Material Notes: Eastman Amphora™ 3D polymer is a low-odor, styrene-free choice that is uniquely suited for 3D printing applications. With Amphora, makers can create items that are more functional, durable, efficient, and attractive. Now you can fulfill your vision with 3D creations that exhibit excellent aesthetics and superior toughness. Amphora also complies with certain U.S. Food and Drug Administration (FDA) regulations for food contact applications. That means, with Amphora, you’ll be able to make a lot of things you can’t with other materials. Best of all, you’ll be able to make certain your final product meets your expectations.

Applications/Uses:

  • Production of 3D Printing filaments
Key Attributes:
  • Clarity and gloss
  • Dimensional stability
  • Ease of processing
  • Enhanced aesthetics
  • Excellent toughness and temperature resistance
  • FDA compliance
  • Low odor
  • Property retention in 3D applications
  • Styrene-free
  • Workability

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Physical PropertiesOriginal ValueComments
Density 1.27 g/ccASTM D792
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell R 108ASTM D785
Tensile Strength at Break 28.0 MPaASTM D638
Tensile Strength, Yield 50.0 MPaASTM D638
Elongation at Break 110 %ASTM D638
Elongation at Yield 5 %ASTM D638
Tensile Modulus 1900 MPaASTM D638
Flexural Modulus 2100 MPaASTM D790
Izod Impact, Notched 93.0 J/m
@Temperature 23.0 °C
ASTM D256
Izod Impact, Unnotched NB
@Temperature 23.0 °C
ASTM D4812
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 0.46 MPa (66 psi) 70.0 °CASTM D648
Deflection Temperature at 1.8 MPa (264 psi) 62.0 °CASTM D648
 
Optical PropertiesOriginal ValueComments
Transmission, Visible 90 %Manufacturer mentions clarity but doesn't quantify
 
Processing PropertiesOriginal ValueComments
Nozzle Temperature 245 °C
 
Descriptive Properties
Processing - CoolingAs needed up to 100%
Processing - Heated Bed 70°C (158°F)
Processing - Infill50-90%
Processing - Layer Height0.2 mm
Processing - Perimeter1.2 mm
Processing - Speed30-60 mm/s

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