Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive

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Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive
Material Notes:	100 parts resin to 6 parts hardener. TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gold, high stress absorption, conductivity, and mechanical performance. This smooth paste formulation of pure silver and epoxy is free of solvents and extraneous additives. It develops strong, durable, electrically and thermally conductive bonds between many dissimilar materials including gold and other metals, ceramics and plastic laminates. Information provided by Resin Technology Group.
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Physical Properties	Original Value	Comments

Specific Gravity	2.40 g/cc
Solids Content	100 %	Reactive

Mechanical Properties	Original Value	Comments
Hardness, Shore D	80
Shear Strength	1400 psi	Cured 1 hour at 125°C, Al/Al
	1600 psi	Cured 30 minutes at 150°C, Al/Al
	1700 psi	Cured 1 hour at 125°C, Au/Au
	1800 psi	Cured 30 minutes at 150°C, Au/Au
	1900 psi	Cured 2 hours at 125°C, Al/Al
	2000 psi	Cured 2 hours at 125°C, Au/Au

Electrical Properties	Original Value	Comments
Volume Resistivity	0.00020 ohm-cm	cured 2 hours at 125°C
	0.00030 ohm-cm	cured 30 minutes at 150°C
	0.00050 ohm-cm	cured 1 hour at 125°C
	0.0050 ohm-cm	cured 4 hours at 65°C

Thermal Properties	Original Value	Comments
Thermal Conductivity	0.00370 cal cm/sec-cm²-°C
Maximum Service Temperature, Air	135 °C
Minimum Service Temperature, Air	-60.0 °C

Processing Properties	Original Value	Comments
Pot Life	240 min @Temperature 25.0 °C

Descriptive Properties
Color	Silver
Viscosity	Smooth paste	After mixing

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