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Ensinger SPI

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Ensinger TECASINT™ 2061 Polyimide, 15% Graphite, 10% PTFE Filled (PI)
Categories: Polymer; Thermoplastic; Polyimide, Thermoplastic; Thermoplastic Polyimide, Graphite Filled; Thermoplastic Polyimide, Molded, PTFE Filled

Material Notes: TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it’s long term thermal stability, outstanding wear resistance, high creep resistance, and strength up to its continuous use temperature of 536° F. TECASINT™ 2021 contains 15% graphite and is also available for applications requiring improved wear resistance & lower coefficient of friction.
  • Superior high temperature characteristics (TECASINT™ 2000 series can operate up to 536° F continuously)
  • Excellent long-term thermal stability
  • Outstanding bearing and wear properties (at elevated temperatures, TECASINT™ 2000 formulations offer superior wear rates)
  • Excellent creep resistance
  • High strength and stiffness properties
  • High purity characteristics (only extremely low levels of extractables and ionic impurities are apparent in TECASINT™ 2011)
  • Good chemical resistance (TECASINT™ 2000 series is not attacked by common solvents or fuels and is acceptable for use in contact with many acids)

TECASINT™ 2000 series with their superior physical properties, are ideal for applications in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries. TECASINT™ shapes are excellent candidates for high purity applications in the semiconductor processing industry. Typical components produced from TECASINT™ applications include seals, thrust washers, bushings and wear pads in transportation/off-highway equipment, insulating and support elements in electrical welding and brazing equipment, and wafer-handling components in the harsh environment of semiconductor plasma ovens. Pump and valve seals, vanes, and piston rings are also commonly produced from TECASINT™ series materials.

Information Provided by Ensinger Inc.

Vendors: Ensinger High Performance Plastics withstand severe environments, resist harsh chemicals, and perform well in extreme temperatures. They offer weight savings that have potential to drive lower cost systems.

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Physical PropertiesOriginal ValueComments
Density 1.51 g/cc
@Temperature 23.0 °C
DIN 53 479
Filler Content 10 %PTFE
 15 %Graphite
Water Absorption 0.35 %
@Temperature 23.0 °C,
Time 86400 sec
EN ISO 62
 1.5 %
@Temperature 80.0 °C,
Time 86400 sec
EN ISO 62
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 84
@Temperature 23.0 °C
DIN 53 505
Tensile Strength, Yield 63.0 MPa
@Temperature 23.0 °C
EN ISO 527
Elongation at Break 2.7 %
@Temperature 23.0 °C
EN ISO 527
Tensile Modulus 3900 MPa
@Temperature 23.0 °C
EN ISO 527
Flexural Strength 89.0 MPa
@Temperature 23.0 °C
EN ISO 178
Flexural Modulus 3490 MPa
@Temperature 23.0 °C
EN ISO 178
Flexural Strain at Yield 3.3 %EN ISO 178
Compressive Yield Strength 142 MPa10% Strain; EN ISO 604
Compressive Strength 164 MPa
@Temperature 23.0 °C
EN ISO 604
Compressive Modulus 1748 MPa
@Temperature 23.0 °C
EN ISO 604
Charpy Impact Unnotched 1.94 J/cm²EN ISO 179
Charpy Impact, Notched 0.320 J/cm²
@Temperature 23.0 °C
EN ISO 179
Compression Set 16.4 %Compression at Break; EN ISO 604
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 536 °F
Glass Transition Temp, Tg 370 °CDMTA
Flammability, UL94 V-0
 
Descriptive Properties
ColorShiny Black
DIN-AbbreviationPI CS15 TF10

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Ensinger TECASINT™ 2011 Polyimide (PI)
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PENSIN054 / 98115

Proto3000 – 3D Engineering Solutions

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