LNP THERMOCOMP EC006PXQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant. Features: FAR 25.853 Compliant,High Stiffness,Light-weight Structural,High Heat Resistance,Super Strong (Carbon Fiber Filled),Exceptional Processing,Electrically Conductive,Structural Information provided by SABIC |