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solder replacement adhesives

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Indium Corp. Indalloy® 281 Bi-Sn Solder Alloy
Categories: Metal; Nonferrous Metal; Bismuth Alloy; Solder/Braze Alloy

Material Notes: Good low melting point solder for electronics assembly of for applications where Cd and Pb are to be avoided, and for thermo-electric applications. Shear rate sensitive.

Information Provided by Indium Corporation

Key Words: lead free, eutectic solder
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Physical PropertiesOriginal ValueComments
Density 8.56 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Brinell 23
@Load 4.00 kg
2mm ball
Tensile Strength, Ultimate 55.2 MPa
Elongation at Break 55 %% elongation on 5.65 (sq. root Area) gauge length
Shear Strength 3.40 MPaShear Bond Holding Strength
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000380 ohm-cm
 
Thermal PropertiesOriginal ValueComments
Heat of Fusion 44.8 J/g
CTE, linear 15.0 µm/m-°C
@Temperature 20.0 °C
Specific Heat Capacity 0.167 J/g-°CSolid
 0.201 J/g-°CLiquid
Thermal Conductivity 19.0 W/m-K
@Temperature 85.0 °C
Melting Point 138 °CEutectic
Solidus 138 °C
Liquidus 138 °C
 
Component Elements PropertiesOriginal ValueComments
Bismuth, Bi 58 %
Tin, Sn 42 %

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NNIN14 / 18470

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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