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Ensinger PEI

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Henkel Loctite® ECCOBOND UF 3915 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black liquid

Cure: Snap Cure or Heat cure

Product Benefits:

  • Halogen free
  • One component
  • Snap curable
  • Fast flow
  • High Tg
  • Easy rework
  • High fracture toughness
  • Excellent thermal cycle performance
  • Compatible with most Pb-free solders
  • Stable electrical performance under thermal/humidity bias
Application: Underfill

Typical Package Application: WLCSP and Flip chip devices

LOCTITE ECCOBOND UF 3915 reworkable underfill is specially designed for flip chip device applications.

Information provided by Loctite®

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Brookfield Viscosity 5500 cPCP51, Speed 20 rpm
 
Mechanical PropertiesOriginal ValueComments
Tensile Modulus 7600 MPaStorage, Cured, DMA
Fracture Toughness 2.20 MPa-m½Instron
Shear Strength 10.0 MPaLap, PCB to PCB
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 3.26
@Frequency 5.00e+9 Hz
 3.32
@Frequency 8.50e+8 Hz
 3.35
@Frequency 2.45e+9 Hz
 3.4
@Frequency 1.575e+9 Hz
Dissipation Factor 0.048
@Frequency 8.50e+8 Hz
 0.050
@Frequency 5.00e+9 Hz
 0.051
@Frequency 2.45e+9 Hz
 0.052
@Frequency 1.575e+9 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 25.0 µm/m-°CCured, Below Tg
 100 µm/m-°CCured, Above Tg
Glass Transition Temp, Tg 125 °CCured, by TMA
 
Processing PropertiesOriginal ValueComments
Cure Time 7.00 min
@Temperature 160 °C
 10.0 min
@Temperature 150 °C
Alternate Cure Schedule
 20.0 min
@Temperature 130 °C
Alternate Cure Schedule
Working Life 24.0 hour
Shelf Life 9.00 Month
@Temperature -40.0 °C
 
Descriptive Properties
Thixotropic Index1.1Uncured

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PLOCT5097 / 255308

Proto3000 – 3D Engineering Solutions

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