Appearance: Black liquid Cure: Snap Cure or Heat cure Product Benefits: - Halogen free
- One component
- Snap curable
- Fast flow
- High Tg
- Easy rework
- High fracture toughness
- Excellent thermal cycle performance
- Compatible with most Pb-free solders
- Stable electrical performance under thermal/humidity bias
Application: Underfill Typical Package Application: WLCSP and Flip chip devices LOCTITE ECCOBOND UF 3915 reworkable underfill is specially designed for flip chip device applications. Information provided by Loctite® |