Henkel Loctite® ABLESTIK CDF 600 Adhesive

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Henkel Loctite® ABLESTIK CDF 600 Adhesive
Categories:	Polymer; Adhesive
Material Notes:	Appearance: Silver film Cure: Heat cure Product Benefits: Low warpage Thermally conductive Electrically conductive High MSL reliability Controlled fillet size No resin bleed-out Consistent bondline control with minimal die tilt Pre-cut wafer lamination equipment compatible Recommended for thin wafer handling applications Good wetting and low warpage for large die Application: Die attach Typical Package Application: PBGA, FBGA, CSP LOCTITE ABLESTIK CDF 600 silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Filler Content	79 %	Uncured

Mechanical Properties	Original Value	Comments
Tensile Modulus	40.0 MPa @Temperature 250 °C
	3000 MPa @Temperature 25.0 °C

Electrical Properties	Original Value	Comments
Volume Resistivity	0.0080 ohm-cm	Bulk

Thermal Properties	Original Value	Comments
CTE, linear	75.0 µm/m-°C	Cured, Below Tg
	320 µm/m-°C	Cured, Above Tg
Thermal Conductivity	1.00 W/m-K	Bulk; ASTM E1461
Glass Transition Temp, Tg	-5.00 °C

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 100°C + 30 minutes @ 100°C + 30 minute ramp to 175°C + 1 hour @ 175°C
Shelf Life	2.00 Month	Uncured, Work life
	12.0 Month @Temperature 0.000 - 5.00 °C	Uncured

Descriptive Properties
Shear Strength	0.7 kg/mm2	Hot Die Shear Strength @ 260°C 2 X 2 mm (80 x 80 mil) die on PPF LF

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PLOCT5051 / 255262

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