Momentive Performance Materials TSE326 High Temperature, Heat Cured One Component Silicone Adhesive

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Momentive Performance Materials TSE326 High Temperature, Heat Cured One Component Silicone Adhesive (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Silicone; Silicone, RTV, Adhesive/Sealant Grade
Material Notes:	TSE326 is a one-component, heat curing silicone adhesive which offers extended performance at temperatures exceeding 200C. A flowable material with primerless adhesion to many substrates, it is suitable for assembly and gasketing where a flowable consistency is required. TSE 326 requires a minimum cure temperature of 100C and offers very low linear shrinkage and an improved thermal conductivity of 0.29 W/m K. Reddish brown in color. Key Performance Properties: One component product-no mixing required Fast cure at elevated temperatures Primerless adhesion to many types of substrates Low linear shrinkage Excellent heat resistance Outstanding dielectric properties GE Silicones became a part of Momentive Performance Materials in 2006.
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Physical Properties	Original Value	Comments

Specific Gravity	1.45 g/cc
Viscosity	28000 cP

Mechanical Properties	Original Value	Comments
Hardness, Shore A	43
Tensile Strength, Ultimate	35.0 kg(f)/cm²
Elongation at Break	170 %
Adhesive Bond Strength	284 psi	Aluminum to aluminum

Electrical Properties	Original Value	Comments
Volume Resistivity	2.00e+15 ohm-cm
Dielectric Constant	3.3
Dielectric Strength	21.97 kV/mm
Dissipation Factor	0.020

Thermal Properties	Original Value	Comments
CTE, linear	170 µm/m-°C @Temperature 20.0 °C

Processing Properties	Original Value	Comments
Cure Time	0.500 hour @Temperature 150 °C
	0.750 hour @Temperature 125 °C
	2.00 hour @Temperature 100 °C

Descriptive Properties
Color	Reddish Brown

**
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