Henkel Loctite® ECCOBOND 50400-1 Epoxy

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Henkel Loctite® ECCOBOND 50400-1 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Cure: Heat Cure Product Benefits: One component Low viscosity Low CTE Application: Encapsulant - glob top LOCTITE ECCOBOND 50400-1 glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable viscosity during use. It is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Density	1.75 g/cc
Solids Content	100 %
Filler Content	70 %
Moisture Absorption	0.400 %	Cured
Brookfield Viscosity	40 cP	Uncured, Sp #6, Speed 20 rpm
	100 cP	Uncured, Sp #6, Speed 2.5 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	95	Cured

Electrical Properties	Original Value	Comments
Volume Resistivity	3.30e+14 ohm-cm
Dielectric Constant	3.2 @Frequency 1000 Hz
Dissipation Factor	0.0090 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear	20.0 µm/m-°C	Cured
Thermal Conductivity	0.630 W/m-K	Cured
Glass Transition Temp, Tg	140 °C	Cured
Shrinkage	0.20 %	With Pre-cure of1hour @ 120°C
	0.50 %	On Cure

Processing Properties	Original Value	Comments
Cure Time	1.00 hour @Temperature 120 °C	+ 1 hour @ 150°C, Low Stress Cure Schedule
	2.00 hour @Temperature 150 °C
Shelf Life	4.00 Month @Temperature -40.0 - 0.000 °C	from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	10	Cured, Chloride (Cl-)
	10	Cured, Sodium (Na+)
	10	Cured, Potassium (K+)
	10	Cured, Ammonium (NH4+)
Pot Life	5 days	@ 40ºC
	7 days	@ 18 to 25ºC

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PLOCT5072 / 255283

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