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solder replacement adhesives

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AIM 95Sn/3.5Ag/1.5In Solder for Photonic Packaging
Categories: Metal; Nonferrous Metal; Solder/Braze Alloy; Tin Alloy

Material Notes: Uses include:
  • Fiber to Ferrule Soldering
  • Laser Die Attach
  • Hermetic Packaging & Sealing
  • Wetting & Sealing Laser Optics
  • Thermal Management

Information provided by AIM Specialty Materials.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 7.36 g/cc
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength, Ultimate 51000 psi
 
Thermal PropertiesOriginal ValueComments
CTE, linear 22.0 µm/m-°C
@Temperature 20.0 °C
Melting Point 218 °C
Solidus 218 °C
Liquidus 218 °C
 
Component Elements PropertiesOriginal ValueComments
Indium, In 1.5 %
Silver, Ag 3.5 %
Tin, Sn 95 %
 
Descriptive Properties
Creep ResistanceHigh

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NAIMSP06 / 14587

Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.

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