Henkel Loctite® ECCOBOND E 1216M Epoxy

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Henkel Loctite® ECCOBOND E 1216M Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Cure: Heat cure Product Benefits: Snap curable Fast, void-free underfill of area array devices Excellent stability during shipping, storage and use Excellent adhesion and strength Non-anhydride curing chemistry Passes NASA outgassing Application: Underfill Typical Package Application: CSP, BGA and Flip Chip BGA LOCTITE ECCOBOND E 1216M innovative capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that fully cures in a single reflow cycle, but is stable enough to be easily shipped and used in large volume cartridges (up to 20 oz). It is specifically formulated to eliminate anhydride-type curing agents for those users who prefer to work with anhydride-free products. LOCTITE ECCOBOND E 1216M passes NASA outgassing standards. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.40 g/cc
Brookfield Viscosity	4000 cP	Spindle 4, speed 20 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	86	Sample cured 5 minutes @ 160ºC
Flexural Modulus	106 MPa @Temperature 250 °C	Cured
	126 MPa @Temperature 200 °C	Cured
	192 MPa @Temperature 150 °C	Cured
	3830 MPa @Temperature 100 °C	Cured
	6010 MPa @Temperature 25.0 °C	Cured
	7380 MPa @Temperature -65.0 °C	Cured

Electrical Properties	Original Value	Comments
Volume Resistivity	2.82e+16 ohm-cm
Surface Resistance	1.09e+14 ohm
Dielectric Constant	2.5 @Frequency 1e+6 Hz
Dielectric Strength	42.0 kV/mm
Dissipation Factor	0.0118 @Frequency 1e+6 Hz

Thermal Properties	Original Value	Comments
CTE, linear	35.0 µm/m-°C	Cured, Below Tg
	131 µm/m-°C	Cured, Above Tg
Thermal Conductivity	0.420 W/m-K	Cured, Laser Flash
Glass Transition Temp, Tg	125 °C	Cured, by TMA

Processing Properties	Original Value	Comments
Cure Time	3.00 min @Temperature 165 °C	Snap or Inline Cure
	4.00 min @Temperature 150 °C	Fast Cure
	10.0 min @Temperature 130 °C	Fast Cure
Working Life	120 hour	Worklife, 50% increase in viscosity
Shelf Life	12.0 Month @Temperature -20.0 °C

Descriptive Properties
Flow Rate	9 sec	1cm travel, 200µm gap @ 80°C

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PLOCT5105 / 255316

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