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Master Bond adhesives

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434 Stainless Steel annealed at 815°C, cold worked to 89 HRB
Categories: Metal; Ferrous Metal; Heat Resisting; Stainless Steel; T 400 Series Stainless Steel

Key Words: AFNOR Z 8 CD 17.01 (Fr), UNI X 8 CrMo 17, JIS SUS 434, SS14 2325 (Sweden), UNS S43400, ASTM A651, SAE J405 (51434), DIN 1.4113, B.S. 434 S 19
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Physical PropertiesOriginal ValueComments
Density 7.80 g/cc
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell B 89
Tensile Strength, Ultimate 538 MPa
 34.0 MPa
@Temperature 870 °C
 66.0 MPa
@Temperature 760 °C
 134 MPa
@Temperature 650 °C
 272 MPa
@Temperature 540 °C
 379 MPa
@Temperature 425 °C
 459 MPa
@Temperature 205 °C
Tensile Strength, Yield 441 MPa
@Strain 0.2 %
 28.0 MPa
@Strain 0.2 %,
Temperature 870 °C
 52.0 MPa
@Strain 0.2 %,
Temperature 760 °C
 114 MPa
@Strain 0.2 %,
Temperature 650 °C
 234 MPa
@Strain 0.2 %,
Temperature 540 °C
 317 MPa
@Strain 0.2 %,
Temperature 425 °C
 390 MPa
@Strain 0.2 %,
Temperature 205 °C
Elongation at Break 32 %in 50 mm
 28 %
@Temperature 205 °C
in 50 mm
 28.5 %
@Temperature 425 °C
in 50 mm
 30 %
@Temperature 540 °C
in 50 mm
 43.5 %
@Temperature 650 °C
in 50 mm
 70.5 %
@Temperature 760 °C
in 50 mm
 95.5 %
@Temperature 870 °C
in 50 mm
Modulus of Elasticity 200 GPa
 
Electrical PropertiesOriginal ValueComments
Electrical Resistivity 0.0000600 ohm-cm
@Temperature 20.0 °C
Magnetic Permeability 600 - 1100annealed condition at RT
 
Thermal PropertiesOriginal ValueComments
CTE, linear 10.4 µm/m-°C
@Temperature 0.000 - 100 °C
 11.0 µm/m-°C
@Temperature 0.000 - 315 °C
 11.3 µm/m-°C
@Temperature 0.000 - 540 °C
 11.9 µm/m-°C
@Temperature 0.000 - 650 °C
 12.4 µm/m-°C
@Temperature 0.000 - 815 °C
Specific Heat Capacity 0.460 J/g-°C
@Temperature 0.000 - 100 °C
Thermal Conductivity 26.1 W/m-K
@Temperature 100 °C
 26.3 W/m-K
@Temperature 500 °C
Melting Point 1425 - 1510 °C
Solidus 1425 °C
Liquidus 1510 °C
 
Component Elements PropertiesOriginal ValueComments
Carbon, C <= 0.12 %
Chromium, Cr 16 %
Iron, Fe 81 %
Manganese, Mn <= 1.0 %
Molybdenum, Mo 1.0 %
Phosphorus, P <= 0.040 %
Silicon, Si <= 1.0 %
Sulfur, S <= 0.030 %

References for this datasheet.

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