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Master Bond adhesives

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Epoxyset Epoxibond EB-119M Unfilled Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: A two-component,unfilled, low viscosity, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.

Information provided by Epoxyset Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Density 1.14 g/cc
Viscosity 800 - 1200 cP
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 91ASTM D2240
Adhesive Bond Strength 2200 psiLap Shear Strength
 
Thermal PropertiesOriginal ValueComments
CTE, linear >= 50.0 µm/m-°C
Maximum Service Temperature, Air 230 °C
Minimum Service Temperature, Air -55.0 °C
Glass Transition Temp, Tg >= 130 °C
 
Optical PropertiesOriginal ValueComments
Refractive Index 1.57
 
Processing PropertiesOriginal ValueComments
Cure Time 0.500 hour
@Temperature 150 °C
 1.00 hour
@Temperature 100 °C
Pot Life >= 360 min

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PEPOXY809 / 150834

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