| AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging. Appearance: Resin: Brown, Hardener: Dark Brown Cure Type: Heat cure or Room temperature Benefits: - Gold filled epoxy allows for antioxidation of contacts and terminals in high reliability devices.
- It can be used in medical circuits using traditional hybrid packaging technologies.
- High viscosity paste allows for precision deposition onto circuits by means of printing and delicate hand processes.
Mix Ratio by weight: 100:13.5/Resin:Hardener Substrates: Metals, ceramics, glass, glass fabrics, wood leather and rigid plastics Typical Application: - Adhesive for joining die and SMDs onto the hybrid circuits.
- Repairing defective Au thick-film conductor traces and contact pads.
- Resisting oxidation and electromigration in high-reliability microelectronics.
- Joining material as alternative to high temperature Au-Sn eutectic solders processes exceeding 300°C.
Information provided by Atom Adhesives |
