Parker Chomerics CHO-FOIL CCE Shielding Tape

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Parker Chomerics CHO-FOIL CCE Shielding Tape
Categories:	Polymer; Adhesive; Tape
Material Notes:	Conductive Adhesive Copper Foil Description: Chomerics’ CHO-FOIL® tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive. Typical Applications: Provide a low impedance connection between a braided cable shield and the metal connector backshell in molded cables. An effective EMI shielded assembly can be achieved without soldering the tape to the braid or backshell; EMI radiation measurement troubleshooting, using CHO-FOIL tape to shield ventilation slots or seam gaps; Provide electrical continuity in seams of EMI shielded rooms and electronic enclosures; Supply electrical contact to surfaces that can’t be soldered to, such as conductive plastic or aluminum; EMI shield for cables by wrapping the tape around the cable. An overlap is recommended; ESD shielding; Provide corrosion-resistant ground contact points; Fabric tape available where weight and flexibility are important, such as for wrapping cables. Information provided by Chomerics
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Physical Properties	Original Value	Comments

Thickness	1.40 mil	Foil thickness
	1.50 mil	Adhesive thickness
	4.00 mil	Total; Embossing adds 1.1 mil

Mechanical Properties	Original Value	Comments
Peel Strength	2.80 pli	Initial; ASTM D1000
	3.70 kN/m @Temperature 121 °C, Time 605000 sec	ASTM D1000
	3.90 pli @Temperature 85.0 °C, Time 605000 sec	ASTM D1000
Taber Abrasion, mg/1000 Cycles	<= 10	500 gram weight. CS-10 wheel; CHO-TP-57

Electrical Properties	Original Value	Comments
Surface Resistance	<= 0.0020 ohm	Initial Surface Resistivity (SR)
	<= 0.0030 ohm	Initial through resistivity (TR)
	<= 0.0030 ohm	Initial Taber Abrasion; CHO-TP-57
	<= 0.0020 ohm @Temperature 85.0 °C, Time 605000 sec	(SR); CHO-TP-57
	<= 0.0030 ohm @Temperature 85.0 °C, Time 605000 sec	(TR); CHO-TP-57
	<= 0.0030 ohm @Temperature 121 °C, Time 605000 sec	(SR); CHO-TP-57
	<= 0.0030 ohm @Temperature 121 °C, Time 605000 sec	(TR); CHO-TP-57
Surface Resistivity per Square	<= 0.0030 ohm	[ohm/in^{2^{]; <.0005 ohm/cm²; MIL-STD-202C}}

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	205 °C
Minimum Service Temperature, Air	-40.0 °C

Descriptive Properties
Adhesion to Aluminum	>40 oz./inch	ASTM D1000
Adhesive Type	Electrically Conductive, Pressure-Sensitive Acrylic
Flame Resistance (UL Subject 510)	Meets
Foil/Fabric Type	1 oz. Embossed RA Copper

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