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Master Bond adhesives

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Parker Chomerics Tecksof 2000 Conductive Fabric Over Foam Gasket
Categories: Polymer

Material Notes: Description: The Tecknit TECKSOF 2000 Series gasket consists of conductive fabric over foam and has been designed to meet today’s commercial EMI shielding applications demands where wide tolerance gaps exist. The foam core is flexible and conformable, making it ideal for applications requiring low closure force and minimal compression set. Tecknit TECKSOF 2000 Series gaskets are ideal suited for commercial electronic enclosures.

Application Information: Conduct soft gaskets are an ideal low cost solution for placement in enclosures where weight and space are limited. TECKSOF 2000 is an excellent choice where conformability as well as high shielding requirements are specified. Applications recommended include electronic cabinets/enclosures, laptop computers, cellular devices and portable electronic devices such as PDA’s

Corrosion Resistance: Galvanic Compatiblity With Aluminum, Galvanized Steel, Electrogalvanized Steel and Other Materials

Information provided by Chomerics

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Physical PropertiesOriginal ValueComments
Viscosity >= 5.0 cPASTM D2196
 
Mechanical PropertiesOriginal ValueComments
Compression Set >= 10 %Profile Dependent
 8.0 - 20 %
 30 - 40 %Typical
 <= 80 %Profile Dependent
 
Electrical PropertiesOriginal ValueComments
Surface Resistivity per Square <= 0.050 ohmTypically
 <= 0.070 ohm
Shielding Effectiveness >= 100 dB
@Frequency 2.0e+7 - 1.00e+10 Hz
.25" x .375" Profiles; MIL-G-83528B
 
Thermal PropertiesOriginal ValueComments
Maximum Service Temperature, Air 70.0 °C
Minimum Service Temperature, Air -40.0 °C
Brittleness Temperature -55.0 °CASTM D2137
Flammability, UL94 V-1Depending on Profile
 V-0Depending on Profile
 
Descriptive Properties
Extractable Silicone0.04

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