Henkel Loctite® ABLESTIK ATB 120U Rubberized Epoxy

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Henkel Loctite® ABLESTIK ATB 120U Rubberized Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Transparent Cure: Heat cure Product Benefits: Non-conductive Fast cure Thin bondline Excellent gap filling ability L2/260ºC performance Application: Die attach Filler Type: Silica Typical Package Application: Die to die stack Carrier Type: Polyolefin LOCTITE ABLESTIK ATB 120U adhesive film is formulated for use in wafer lamination processes. It combines process ease with the proven reliability. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Moisture Absorption	1.50 % @Temperature 85.0 °C	Saturation, after 85% RH exposure

Mechanical Properties	Original Value	Comments
Tensile Modulus	1.00 MPa @Temperature 200 °C	Cured, DMTA
	2.00 MPa @Temperature 250 °C	Cured, DMTA
	3.00 MPa @Temperature 150 °C	Cured, DMTA
	40.0 MPa @Temperature 100 °C	Cured, DMTA
	875 MPa @Temperature 25.0 °C	Cured, DMTA
	2330 MPa @Temperature -65.0 °C	Cured, DMTA

Thermal Properties	Original Value	Comments
CTE, linear	62.0 µm/m-°C	Cured, Below Tg
	238 µm/m-°C	Cured, Above Tg
Thermal Conductivity	0.210 W/m-K	Cured
Glass Transition Temp, Tg	75.0 °C	Cured, TMA

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 120°C + 30 minutes @ 120°C
	30.0 min	ramp to 90°C + 30 minutes @ 90°C + 30 minute ramp to 120°C + 30 minutes @ 120°C
Shelf Life	1.00 Month	Uncured, Work life
	9.00 Month @Temperature 5.00 °C	Uncured, from date of manufacture

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Chloride (Cl-)
	<10	Cured, Fluoride (F-)
	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
Shear Strength	2 kg-f	Die, 2.5 X 2.5 mm Si die frontside @260°C
	40 kg-f	Die, 2.5 X 2.5 mm Si die frontside @25°C
Weight Loss	<1%	Cured, 300°C

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PLOCT5048 / 255259

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