Cookson Group Plaskon® SE3001 Silver Filled Epoxy

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Cookson Group Plaskon® SE3001 Silver Filled Epoxy (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes:	This material is an electrically conductive, die attach adhesive that has been formulated for microdot dispensing. The material is hardened by thermal processing in IR, convection, conduction or vapor phase equipment. Our combination of low cure times and superior thermal aging sets SE3001 apart from competition for die attach materials in the semiconductor industry. Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Filler Content	75 - 79 %	75 - 79 %
Viscosity	23000 - 49000 cP @Temperature 25.0 °C	23000 - 49000 cP @Temperature 77.0 °F	HBT 5x cp-51 spindle, 10 rpm
	150000 - 220000 cP @Temperature 25.0 °C	150000 - 220000 cP @Temperature 77.0 °F	HBT 5x cp-51 spindle, 1 rpm

Mechanical Properties	Metric	English	Comments
Adhesive Bond Strength	>= 15.9 MPa	>= 2300 psi	Die shear

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00010 ohm-cm	<= 0.00010 ohm-cm

Thermal Properties	Metric	English	Comments
CTE, linear	54.0 µm/m-°C	30.0 µin/in-°F	Below Tg
Thermal Conductivity	4.00 - 5.00 W/m-K	27.8 - 34.7 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	90.0 °C	194 °F

Processing Properties	Metric	English	Comments
Pot Life	480 - 720 min	480 - 720 min
Shelf Life	6.00 Month @Temperature -40.0 °C	6.00 Month @Temperature -40.0 °F

Descriptive Properties
Bonding Range	130-170°C
Filler Material	Silver
Junction Resistivity	<5 mohm
Thixotropic Index	4.5-6.5

**
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PPLASK085 / 56375

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