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SABIC LNP™ THERMOCOMP™ Compound GF004 Polysulfone (PSU) (Asia)
Categories: Polymer; Thermoplastic; Polysulfone (PSU)

Material Notes: LNP THERMOCOMP GF004 compound is based on Polysulfone (PSU) resin containing 20% glass fiber.

Features: High Stiffness,Structural

Information provided by SABIC

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Physical PropertiesOriginal ValueComments
Density 1.40 g/ccISO 1183
 1.41 g/ccASTM D792
Moisture Absorption 0.100 %23°C/50% RH/24 hrs; ASTM D570
Linear Mold Shrinkage, Flow 0.0060 cm/cm24hrs; ASTM D955
 0.0064 cm/cm24hrs; ISO 294
Linear Mold Shrinkage, Transverse 0.0085 cm/cm24hrs; ISO 294
 0.0090 cm/cm24hrs; ASTM D955
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 91.0 MPaASTM D638
Tensile Strength, Yield 91.0 MPaASTM D638
Elongation at Break 2.3 %ASTM D638
Elongation at Yield 2.3 %ASTM D638
Tensile Modulus 6200 MPa50 mm/min; ASTM D638
Flexural Strength 137 MPaASTM D790
 145 MPaISO 178
Flexural Modulus 6000 MPaISO 178
 6200 MPaASTM D790
Izod Impact Notched 53.0 JASTM D256
Izod Impact, Unnotched 427 J/mASTM D4812
Izod Impact, Notched (ISO) 6.00 kJ/m²80*10*4; ISO 180/1A
Izod Impact, Unnotched (ISO) 31.0 kJ/m²80*10*4; ISO 180/1U
Dart Drop, Total Energy 10.0 Jpeak; ASTM D3763
 
Thermal PropertiesOriginal ValueComments
CTE, linear, Parallel to Flow 25.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
ISO 11359-2
 25.2 µm/m-°C
@Temperature -40.0 - 40.0 °C
ASTM E831
CTE, linear, Transverse to Flow 52.0 µm/m-°C
@Temperature -40.0 - 40.0 °C
ISO 11359-2
 52.2 µm/m-°C
@Temperature -40.0 - 40.0 °C
ASTM E831
Deflection Temperature at 0.46 MPa (66 psi) 180 °CFlatw 80*10*4 sp=64mm; ISO 75/Bf
 178 °C
@Thickness 3.20 mm
unannealed; ASTM D648
Deflection Temperature at 1.8 MPa (264 psi) 174 °CFlatw 80*10*4 sp=64mm; ISO 75/Af
 173 °C
@Thickness 3.20 mm
unannealed; ASTM D648

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PSABH81604 / 289551

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