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Chemically Resistant adhesives

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Lord Adhesives CoolTherm™ SC-104 Thermally Conductive Silicone Encapsulant
Categories: Polymer; Thermoset; Silicone; Silicone Elastomer, for Thermal Management

Material Notes: LORD CoolTherm™ SC-104 thermally conductive encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones. CoolTherm SC-104 encapsulant can be either room temperature cured or heat cured for maximum adhesion. CoolTherm SC-104 hardener evolves minute quantities of hydrogen gas. Do not repackage or store material in unvented containers. Adequately ventilate work area to prevent the accumulation of gas.

Features: exhibits low shrinkage and stress on components as it cures. composed of an addition-curing polydimethyl siloxane polymer that will not depolymerize when heated in confined spaces. maintains low viscosity for ease of component encapsulation compared to other highly thermally conductive materials. provides excellent thermal shock resistance. provides excellent flame retardancy; UL 94 V-0 certified. ingredients contained in CoolTherm SC-104 encapsulant are permitted for food contact under FDA food additive regulations (21CFR175.300) when material is properly proportioned, mixed, applied and cured.

All information provided by Lord.

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.10 g/ccSC-104 Resin
 2.10 g/ccSC-104 Hardener
 2.10 g/ccMixed
Water Absorption 0.10 %cured; ASTM D 570-81
Viscosity 6000 cP
@Temperature 25.0 °C
SC-104 Resin
 6000 cP
@Temperature 25.0 °C
SC-104 Hardener
 7000 cP
@Temperature 25.0 °C
Mixed
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 65ASTM D 2240
Tensile Strength 480 psicured; ASTM D 412
Elongation at Break 120 %cured; ASTM D 412
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 2.20e+15 ohm-cm
@Temperature 25.0 °C
cured; ASTM D 257
Dielectric Constant 3.06
@Frequency 1e+6 Hz,
Temperature 25.0 °C
cured; ASTM D 150
Dielectric Strength 440 V/milcured; ASTM D 149
Dissipation Factor 0.0075
@Frequency 1e+6 Hz,
Temperature 25.0 °C
cured; ASTM D 150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 160 µm/m-°Ccured; ASTM C 864
Thermal Conductivity 0.800 W/m-KHot Disc Transient Method, cured
Flammability, UL94 V-0
 
Processing PropertiesOriginal ValueComments
Working Life 50.0 min
@Temperature 25.0 °C
Mixed
Gel Time 60.0 min
@Temperature 25.0 °C
mixed, cured
Shelf Life 9.00 Month
@Temperature 25.0 °C
each component from date of manufacture
 
Compliance PropertiesOriginal ValueComments
FDA Yes
 
Descriptive Properties
AppearanceBlack LiquidSC-104 Hardener
 Grey LiquidMixed
 White LiquidSC-104 Resin

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PLORD9288 / 232644

Chemically Resistant adhesives

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