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Flame Retardant adhesives

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Cookson Group Plaskon® MUF-2B Molded Underfill Compound for Flip Chip BGAs and CSPs  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON MUF Series is the total molded underfill solution for Flip Chip in Package.

Features:

  • Higher productivity
  • Higher Tg
  • Higher reliability
  • Lower warpage
  • Lower CTE
  • Lower cost of ownership
  • Minimum 220°C reflow
  • Minimum JEDEC Level 3

Applications:

Plaskon MUF-2B Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies where the combination of low wire sweep and underfill properties are essential.

Mold Applications:

Plaskon MUF-2A is suitable to vent hole assist molding approaches for underfilling flip chip packages. It will work in matrix, strip and singulated molds.

Information provided by Cookson Electronics

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.89 g/cc
Viscosity 5000 cP
@Temperature 175 °C
Shimadzu Viscosity, 1000 psi
Linear Mold Shrinkage 0.00050 cm/cm
Spiral Flow 125 cmat 175°C and 1000 psi
Ash 80 %
Storage Temperature <= 5.00 °CRecommended
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 85Cull hot
Flexural Strength 12090 psi
 4978.2 psi
@Temperature 215 °C
Flexural Modulus 2.560e+6 psi
 853400 psi
@Temperature 215 °C
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 4.50e+15 ohm-cm
Dielectric Constant 3.13
@Frequency 1000 Hz
Dielectric Strength >= 800 V/mil
Dissipation Factor 0.0017
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 16.0 µm/m-°C
@Temperature 20.0 °C
Alpha 1
 55.0 µm/m-°C
@Temperature 20.0 °C
Alpha 2
Thermal Conductivity 0.750 W/m-K
Glass Transition Temp, Tg 195 °C
Flammability, UL94 V-0
@Thickness 3.17 mm
 
Processing PropertiesOriginal ValueComments
Mold Temperature 165 - 170 °C
Back Pressure 500 - 900 psi
Cure Time 100 - 200 secIn mold
Gel Time 0.233 minRam follower, at 175°C and 1000 psi
Shelf Life 0.0670 Monthat 35°C, <40% loss of spiral flow
 0.167 Monthat 21°C, <40% loss of spiral flow
 24.0 Monthat 5°C, <40% loss of spiral flow
 
Descriptive Properties
Hydrolyzable Halides<1 ppm
Preform Temperature80-85°C
Transfer Time6-15 seconds

**
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PPLASK033 / 56323

Flame Retardant adhesives

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