Henkel Loctite® ECCOBOND EO7021 Epoxy

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Henkel Loctite® ECCOBOND EO7021 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Black Cure: Heat Cure Product Benefits: One component Low viscosity Fast cure at moderate temperatures Application: Encapsulant, Coating LOCTITE EO7021 encapsulant is designed for use in smart card chip module applications. It is also suitable for die attach automated reel-toreel processing . Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.19 g/cc
Viscosity	17000 cP	Spindle D, speed 5 rpm

Mechanical Properties	Original Value	Comments
Hardness, Shore D	>= 83	Cured; DIN 53505
Tensile Strength	48.0 MPa	Cured; ASTM D638
Elongation at Break	>= 3.97 %	Cured
Tensile Modulus	1447 MPa	ASTM D638
Flexural Strength	0.105 MPa	Cured; ASTM D790
Flexural Modulus	3364 MPa	Cured; ASTM D790

Electrical Properties	Original Value	Comments
Volume Resistivity	1.98e+17 ohm-cm	100 volts; ASTM D257
Surface Resistance	5.21e+16 ohm	100 volts; ASTM D257
Dielectric Constant	3.556 @Frequency 100000 Hz	ASTM D150
	3.627 @Frequency 10000 Hz	ASTM D150
	3.666 @Frequency 1000 Hz	ASTM D150
	3.682 @Frequency 10 Hz	ASTM D150
Dissipation Factor	0.0056 @Frequency 10 Hz	ASTM D150
	0.0063 @Frequency 1000 Hz	ASTM D150
	0.0089 @Frequency 10000 Hz	ASTM D150
	0.016 @Frequency 100000 Hz	ASTM D150
Arc Resistance	88.7 sec	ASTM D495

Thermal Properties	Original Value	Comments
CTE, linear	67.0 µm/m-°C @Temperature 40.0 - 100 °C	Cured, alpha1
	187 µm/m-°C @Temperature 160 - 200 °C	Cured, alpha2
Glass Transition Temp, Tg	125 °C	Cured
Shrinkage	0.73 %	ASTM D2566

Processing Properties	Original Value	Comments
Gel Time	4.00 min @Temperature 120 °C
	7.00 min @Temperature 110 °C
	15.0 min @Temperature 100 °C
Shelf Life	9.00 Month @Temperature 5.00 °C	from date of manufacture

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PLOCT5075 / 255286

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