Cookson Group STAYSTIK® 415 Non-Filed Dielectric Interposer Film

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Cookson Group STAYSTIK® 415 Non-Filed Dielectric Interposer Film (discontinued **)
Categories:	Polymer; Adhesive; Film; Thermoplastic
Material Notes:	These thermoplastic adhesive films are designed for use in a variety of electronic applications. These materials are ideal for applications where resistance to high temperature excursions is desired. These film adhesives can be used for die attach in solder sealed, hermetic packages and have demonstrated low RGA moisture readings. This high temperature, reworkable thermoplastic system offers many unique advantages in applications traditionally ill-suited to thermoset adhesives. Features: Fully polymerized resin - No "cure" Easily reworkable - No outgassing Bonds in seconds - Not hours or minutes Low modulus reduces stress to bonded materials Information provided by Cookson Electronics
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Mechanical Properties	Original Value	Comments

Modulus of Elasticity	>= 360 ksi
Adhesive Bond Strength	>= 3500 psi	Die shear adhesion, at 25°C

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+9 ohm-cm

Thermal Properties	Original Value	Comments
Thermal Conductivity	<= 0.250 W/m-K
Maximum Service Temperature, Air	200 °C	Continuous use
	<= 400 °C	Excursion Temperature
Minimum Service Temperature, Air	-65.0 °C	Continuous use
Glass Transition Temp, Tg	180 - 185 °C

Processing Properties	Original Value	Comments
Shelf Life	12.0 Month	at 25°C

Descriptive Properties
Attach Temperature	300-375°C
Filler Material	None

**
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PPLASK064 / 56354

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