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Master Bond adhesives

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Henkel Loctite® 3143 Deep Potting Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced; Epoxy, Thermally Conductive

Material Notes:
Potters
Loctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and shock resistance of assemblies.

For electronics assembly, Loctite offers deep potting, high adhesion, non-corrosive, and thermally conductive potting products. These can be cured with heat, UV light, or moisture.

Loctite® 3143 Deep Potting Epoxy
A heat cure soft epoxy for deep potting applications that require low shrinkage, thermal stability and environmental resistance. Cure Type: Heat Bonding Type: 2 part epoxy

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Physical PropertiesOriginal ValueComments
Viscosity 1800 cPMixed
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore A 15
Hardness, Shore OO 64
 
Thermal PropertiesOriginal ValueComments
CTE, linear 70.0 µm/m-°C
@Temperature 20.0 °C
Glass Transition Temp, Tg -27.0 °C
 
Processing PropertiesOriginal ValueComments
Cure Time 3.00 hour
@Temperature 80.0 °C
Pot Life 30.0 min
@Temperature 80.0 °C
Gel Time 90.0 minat 80°C

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PLOCT194 / 51930

Rulon Bearings

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