Introduction: Two components modified, unfilled and thixotropic epoxy system. Easy mixing ratio 2:1 by volume. Solvent free. Sag resistance till 5 mm. High toughness. Good thermal resistance. It is advisable to use the system at a temperature not lower than 20-25°C. Application: Structural thermal resistant bonding. Adhesive for assembly of composite materials, metals, automotive components, sport components. Cured: 24 h at R.T. (23±2° C) + 15 h at 60° C Information provided by Poolkemie |