UBE UPIA® ST (U-Varnish-S) 1002 Polyimide Film

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UBE UPIA® ST (U-Varnish-S) 1002 Polyimide Film
Categories:	Polymer; Thermoset; Polyimide, TS; Polyimide, Thermoset Film
Material Notes:	Polyimide film obtained from "UPIA®" exhibits a high thermal decomposition temperature. Especially, "UPIA®-ST (U-Varnish-S)" has a thermal decomposition temperature above 550°C, so it does not soften, fluidize, or decompose under use temperatures and it is able to be used in high-temperature processes. In addition, the polyimide coating has excellent dimensional stability even at high temperatures. Information provided by UBE Industries, LTD
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Physical Properties	Original Value	Comments

Solids Content	17 - 19 % @Temperature 350 °C, Time 1800 sec
	17 - 19 % @Temperature 350 °C, Time 1800 sec
Viscosity	100000 - 110000 cP @Temperature 30.0 °C	E-type Solution Viscosity in NMP
	100000 - 110000 cP @Temperature 30.0 °C	E-type Solution Viscosity in NMP
Thickness	20.0 microns
	50.0 microns

Mechanical Properties	Original Value	Comments
Tensile Strength	465 MPa	ASTM D882
	540 MPa	ASTM D882
Elongation at Break	35 %	ASTM D882
	37 %	ASTM D882
Tensile Modulus	9.60 GPa	ASTM D882
	10.1 GPa	ASTM D882

Electrical Properties	Original Value	Comments
Volume Resistivity	>= 1.00e+14 ohm-cm	ASTM D257
	>= 1.00e+14 ohm-cm	ASTM D257
Surface Resistance	>= 1.00e+16 ohm	ASTM D257
	>= 1.00e+16 ohm	ASTM D257
Dielectric Strength	6.70 kV/mm	ASTM D149
	9.00 kV/mm	ASTM D149

Thermal Properties	Original Value	Comments
CTE, linear	3.00 µm/m-°C @Temperature 50.0 - 200 °C	Fine linear dilatometer
	6.00 µm/m-°C @Temperature 50.0 - 200 °C	Fine linear dilatometer
Glass Transition Temp, Tg	327 °C	Film property; Dynamic viscoelasticity
	327 °C	Film property; Dynamic viscoelasticity
Decomposition Temperature	>= 550 °C

Descriptive Properties
5% Weight Reduction Temp. (°C)	609	TGA. Film property
	615	TGA. Film property
Heat Treatment Highest Temp.	450
	450

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PUBD9860 / 287323

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