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Ensinger PEI

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Rogers Corporation Syron™ 7000 Thermoplastic Circuit Material
Categories: Polymer; Thermoplastic
Material Notes: SYRON™ 7000 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. SYRON 7000 is thermally stable, with a melt temperature higher than PTFE materials and an estimated relative thermal index (RTI) greater than 200°C. The SYRON products possess impressive chemical and radiation resistance.

Features and Benefits:

  • High maximum operating temperature - suitable for applications where high temperature stability is required
  • Excellent chemical resistance - Ease of processing, Resistant to solvents and reagents used to process circuit boards, and Operates in harsh chemical environments
  • Environmentally friendly - Halogen free/inherently flame retardant, Lead-free solder capable, low smoke/toxicity
  • 1/2 oz. very low profile electrodeposited copper foil cladding

Typical Applications:

  • Flex-to-install applications
  • Lightweight feed manifolds
  • Automotive sensors
  • Conformal circuitry
  • Oil and gas exploration
  • Airborne lightning strike protection

Information provided by Rogers Corporation.
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.55 g/ccASTM D792
Moisture Absorption at Equilibrium 0.20 %D24/23; IPC-TM-650 2.6.2.1
Thickness 2.00 mil
Outgassing - Total Mass Loss 0.090 %TML; ASTM E595
 0.090 %WVR; ASTM E595
Collected Volatile Condensable Material 0.010 %ASTM E595
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength 100 MPaASTM D638
Elongation at Break 4.0 %ASTM D638
Tensile Modulus 1200 ksiASTM D638
Peel Strength 5.00 pliCopper; IPC-TM-650 2.4.8
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+16 ohm-cmCondition A and C96/35/90; IPC 2.5.17.1
Surface Resistance 1.00e+14 ohmCondition A and C96/35/90; IPC 2.5.17.1
Dielectric Constant <= 3.4
@Frequency 1e+10 Hz		Z direction; IPC-TM-650 2.5.5.5.1
Dielectric Strength 4500 V/milIPC-TM-650 2.5.6.2
Dissipation Factor <= 0.0045
@Frequency 1e+10 Hz		Z direction; IPC-TM-650 2.5.5.5.1
 
Thermal PropertiesOriginal ValueComments
CTE, linear 18.0 µm/m-°C
@Temperature 0.000 - 150 °C		X-Direction; IPC-TM-650 2.1.41
 23.0 µm/m-°C
@Temperature 0.000 - 150 °C		Y-Direction; IPC-TM-650 2.1.41
 68.0 µm/m-°C
@Temperature 0.000 - 150 °C		Z-Direction; IPC-TM-650 2.1.41
Thermal Conductivity 0.350 W/m-KASTM C518
Maximum Service Temperature, Air >= 200 °Cpending UL RTI
Flammability, UL94 V-0
@Thickness 0.0508 mm		pending
 
Descriptive Properties
Dimensional Stability-0.04 mm/mMD; IPC-TM-650, 2.2.4; After bake 120°C
 0.1 mm/mCMD; IPC-TM-650, 2.2.4; After bake 120°C
T260pass
Thermal Coefficient of Dielectric Constant7 ppm/°CIPC-TM-650 2.5.5.5.1; -50°C to 150°C
Time to Delamination (T-288)pass

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