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Master Bond adhesives

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Master Bond EP113 Two Component Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy Encapsulant, Unreinforced; Epoxy, High Temperature

Material Notes: Key Features:
  • Ultra low viscosity and very long open time
  • Cures with good toughness
  • Exceptionally low shrinkage upon curing
  • Superior dimensional stability
  • High temperature resistance
  • Stellar electrical insulation
Product Description: Master Bond EP113 is a two component, nano-silica filled epoxy system for potting, coating and sealing. The addition of the nano particles enhances the dimensional stability and the already exceptionally low shrinkage upon curing. EP113 has a 100 to 80 mix ratio by weight. It has an unusually low viscosity along with an especially long open time of 2-4 days. It should be noted that EP113 requires oven curing. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour or longer post cure at 350°F, although, a number of variations are possible. EP113 is a top tier electrical insulator. It bonds well to a wide variety of substrates including metals, composites, glass, ceramics and plastics. As a toughened system, it has good resistance to thermal cycling and shock. When the aforementioned properties are combined with its pronounced low viscosity, it is a highly attractive candidate for potting and encapsulating. Some other positive features include its excellent physical strength profile as well as its chemical resistance to water, oils, acids, bases and fuels. The service temperature range is -100°F to +450°F. EP113 is a versatile, specialty type system that can be used in many different aerospace, electronic and OEM applications where this uncommon blend of product properties is desirable.

Product Advantages:

  • Low viscosity
  • Extraordinarily long open time
  • Can withstand rigorous thermal cycling
  • Marvelous electrical insulation properties
  • First rate physical properties
  • Great optical clarity

Information provided by Master Bond Inc.

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Viscosity 20 - 80 cPPart B
 80 - 140 cPmixed
 100 - 400 cPPart A
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80 - 90
Tensile Strength 12000 - 13000 psi
Tensile Modulus 500000 - 550000 psi
Compressive Strength 24000 - 26000 psi
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 3.60e+11 ohm-cm
@Temperature 150 °C
 >= 3.00e+12 ohm-cm
@Temperature 100 °C
 >= 3.00e+14 ohm-cm
@Temperature 25.0 °C
Dielectric Constant 3.35
@Frequency 60 Hz,
Temperature 25.0 °C
 3.35
@Frequency 1e+6 Hz,
Temperature 25.0 °C
 3.4
@Frequency 1000 Hz,
Temperature 25.0 °C
 3.48
@Frequency 60 Hz,
Temperature 100 °C
 3.53
@Frequency 1000 Hz,
Temperature 100 °C
 3.94
@Frequency 60 Hz,
Temperature 150 °C
 3.99
@Frequency 1000 Hz,
Temperature 150 °C
Dissipation Factor 0.010
@Frequency 1e+6 Hz,
Temperature 100 °C
 0.012
@Frequency 1e+6 Hz,
Temperature 150 °C
 0.020
@Frequency 1e+6 Hz,
Temperature 25.0 °C
 
Thermal PropertiesOriginal ValueComments
CTE, linear 20.0 - 22.0 µm/m-°C
Maximum Service Temperature, Air 450 °F
Minimum Service Temperature, Air -100 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 121 °C
followed by 5-8 hours at 300°F with a 2 hour or longer post cure at 350°F
Working Life 120 - 180 minAfter mixing, 100 g batch
Shelf Life 12.0 Month
@Temperature <=23.9 °C
in original, unopened containers
 
Descriptive Properties
Mixing Ratio100:80 by weightParts A to B

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