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Metal adhesives

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Resinlab® EP1300 Clear Unfilled Electronic Grade Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Resinlab™ EP1300 Clear (Formerly Lab Product W092602) is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It has a pot life of about one hour and cures quickly to a tack free handle strength at room temperature within 3 to 4 hours reaching a tough, semi-rigid state within 48 hours. Cure can be accelerated by the addition of heat. Times and temperatures from ½ hour at 100°C to 1 hour at 80°C or 4 hours at 50°C fill bring the product to full cure. It has good wetting and adhesion to most surfaces and is free flowing to penetrate voids and give good air release. It has very good resistance to water, acids and bases and most organic solvents.

Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 0.960 g/ccPart B; TM R050-16
 1.06 g/ccMixed; TM R050-16
 1.16 g/ccPart A; TM R050-16
Water Absorption 0.29 %
@Time 86400 sec
TM R050-35
Viscosity 5000 cPPart B, RVT, #5, 2.5 rpm; TM R050-12
 10000 cPMixed; TM R050-12
 16000 cPPart A, RVT, #6, 2.5 rpm; TM R050-12
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 80TM R050-17
Tensile Strength at Break 3800 psiTM R050-36
Tensile Strength, Ultimate 4000 psiTM R050-36
Tensile Strength, Yield 1800 psiTM R050-36
Elongation at Break 6.0 - 12 %TM R050-36
Tensile Modulus 200 ksiTM R050-36
Compressive Yield Strength 6500 psiTM R050-38
Compressive Strength 17000 psiUltimate; TM R050-38
 17000 psiBreak; TM R050-38
Compressive Modulus 200 ksiTM R050-38
Adhesive Bond Strength 1000 psiLap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
Peel Strength 2.00 pliAl to Al
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 4.10e+14 ohm-cm
Dielectric Constant 3.5
@Frequency 100 Hz,
Temperature 25.0 °C
Dielectric Strength 850 V/mil
 
Thermal PropertiesOriginal ValueComments
CTE, linear 80.0 µm/m-°C
@Temperature <=112 °C
below Tg
 180 µm/m-°C
@Temperature >=112 °C
above Tg
Thermal Conductivity 0.180 W/m-K
Maximum Service Temperature, Air 150 °C
Minimum Service Temperature, Air -40.0 °C
Glass Transition Temp, Tg 112 °CTM R050-25
 
Optical PropertiesOriginal ValueComments
Transmission, Visible 90 %clear; thickness not quantified
 
Processing PropertiesOriginal ValueComments
Pot Life 45 - 60 minMass: 100g; TM R050-19
 
Descriptive Properties
ColorClear
Mix Ratio1:1Volume
 100:85Weight

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PRESL132 / 101546

Metal adhesives

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