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Master Bond adhesives

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Epoxy Technology EPO-TEK® T6067 Thermally Conductive, Electrically Insulating Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Material Description: A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder dam or dielectric layers in circuit assembly applications.

Information Provided by Epoxy Technology

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Physical PropertiesOriginal ValueComments
Specific Gravity 2.00 g/cc
Particle Size <= 20 µm
Viscosity 300000 - 400000 cP
@Temperature 23.0 °C
1 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 24 ppm
Ionic Impurities - K (Potassium) 13 ppm
Ionic Impurities - Cl (Chloride) 177 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 84
Tensile Modulus 641860 psiStorage
Shear Strength 1522 psiLap
 >= 3400 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 6.00e+9 ohm-cm
Dielectric Constant 4.9
@Frequency 1000 Hz
Dissipation Factor 0.0041
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 16.0 µm/m-°CBelow Tg
 68.0 µm/m-°CAbove Tg
Thermal Conductivity 0.450 W/m-K
Maximum Service Temperature, Air 200 °CContinuous
 300 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 90.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 350 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 hour
@Temperature 150 °C
Minimum
 2.00 hour
@Temperature 125 °C
Minimum
Pot Life 40320 min
Shelf Life 12.0 Month
@Temperature -40.0 °C
 
Descriptive Properties
ColorWhite
ConsistencyHighly viscous paste
Ionic Impurities NH487 ppm
Number of ComponentsSingle
Weight Loss0.48%200°C
 0.71%250°C
 1.22%300°C

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PPOXYT089 / 141128

Rulon Bearings

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