| SUPERTHERM 826M01 is a one-part, smooth paste ULTRA HIGH THERMALLY CONDUCTIVE diamond filled epoxy adhesive recommended for semiconductor die-attach and other micro-electronic applications where the combination of very high thermal conductivity coupled with good electrical insulation over a wide temperature range is required. It develops good adhesion, after a REQUIRED high temperature cure cycle, to and between many different semiconductor substrates, metals, glass, ceramics and laminates. SUPERTHERM 826M01 has a long pot life at 25°C and a shelf life of 6 months when stored at -40°C. It provides both enhanced thermal conductivity and good electrical isolation for active or passive chip-type electronic or surface mounted components in printed, integrated and hybrid circuits, and is ideal for screen, dispenser or pin transfer and application methods. This adhesive complies with the requirements of NASA Outgassing Specification. Information provided by Tra-Con Inc. |
