Henkel Loctite® ECCOBOND NCP 5209 Acrylate

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Henkel Loctite® ECCOBOND NCP 5209 Acrylate
Categories:	Polymer
Material Notes:	Appearance: Pale yellow Cure: Thermal compression and Heat cure Product Benefits: High purity Non-conductive Excellent protection of electrical joints Compatible with small assembly gap and tight pitches Application: Pre-applied underfill LOCTITE ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide fluxing activity to allow solder joint formation and bump protection reliability in flip chip bonding processes. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Specific Gravity	1.50 g/cc
Brookfield Viscosity	12500 cP	Spindle 51, speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	7300 MPa	Storage, Cured, DMA

Thermal Properties	Original Value	Comments
CTE, linear	28.0 µm/m-°C	Cured, Below Tg
	80.0 µm/m-°C	Cured, Above Tg
Glass Transition Temp, Tg	145 °C	Cured, by TMA
	188 °C	Cured, by DMA

Processing Properties	Original Value	Comments
Cure Time	30.0 min	ramp to 160°C + 2 hours @ 160°C
Shelf Life	12.0 Month @Temperature -40.0 °C

Descriptive Properties
Extractable Ionic Content (ppm)	<10	Cured, Sodium (Na+)
	<10	Cured, Potassium (K+)
	<10	Cured, Chloride (Cl-)
Thixotropic Index	2.2	Uncured, 0.5/5 rpm

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PLOCT5087 / 255298

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