Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound

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Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. An epoxy molding compound for the encapsulation of semiconductor devices and fiber optics. Excellent moldability (good release, minimal flash and bleed, and good hot hardness); Superior cosmetics and markability; Outstanding reliability
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Physical Properties	Original Value	Comments

Density	1.92 g/cc
Spiral Flow	66.0 - 90.0 cm	177°C/1000 psi

Mechanical Properties	Original Value	Comments
Hardness, Shore D	80
Flexural Strength	124 MPa
Flexural Modulus	14.0 GPa

Electrical Properties	Original Value	Comments
Dielectric Constant	4.2 @Frequency 1000 Hz
Dielectric Strength	17.0 kV/mm
Dissipation Factor	0.0040 @Frequency 1000 Hz
Arc Resistance	180 sec

Thermal Properties	Original Value	Comments
CTE, linear, Parallel to Flow	27.0 µm/m-°C @Temperature 20.0 °C
CTE, linear, Transverse to Flow	80.0 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity	0.900 W/m-K
Glass Transition Temp, Tg	145 °C
Flammability, UL94	V-0 @Thickness 1.60 mm
	V-0 @Thickness 1.60 mm

Processing Properties	Original Value	Comments
Processing Temperature	171 - 193 °C	Molding temperature

**
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PCOOK305 / 21401

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