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Ensinger PEI

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CoorsTek ADS-96R 96% Alumina Thick Film Substrate
Categories: Ceramic; Oxide; Aluminum Oxide

Material Notes: This high-purity material ensures strong, reliable performance for ceramic substrate application. Applications: thick films and lasers

Key Words: Al2O3
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Physical PropertiesOriginal ValueComments
Density 3.75 g/ccASTM-C373
Water Absorption 0.00 %ASTM-C373
Particle Size 4.0 - 7.0 µmGrain Size; Intercept Method
 
Mechanical PropertiesOriginal ValueComments
Hardness, Rockwell 45 N 82ASTM-E18
Modulus of Elasticity 331 GPaASTM-C623
Flexural Strength 400 MPaASTM-F394
Poissons Ratio 0.25ASTM-C623
Shear Modulus 132 GPaCalculated
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 1.00e+8 ohm-cm
@Temperature 700 °C
ASTM-D1829
 1.00e+9 ohm-cm
@Temperature 500 °C
ASTM-D1829
 1.00e+12 ohm-cm
@Temperature 300 °C
ASTM-D1829
 >= 1.00e+14 ohm-cm
@Temperature 25.0 °C
ASTM-D1829
Dielectric Constant 9.5
@Frequency 1000 Hz
ASTM-D150
 9.5
@Frequency 1e+6 Hz
ASTM-D150
Dielectric Strength 490 V/mil
@Thickness 1.02 mm
ASTM-D149
 600 V/mil
@Thickness 0.635 mm
60 cycles AC avg. RMS; ASTM-D149
Dissipation Factor 0.00040
@Frequency 1e+6 Hz
ASTM-D150
 0.0010
@Frequency 1000 Hz
ASTM-D150
Dielectric Loss Index 0.0040
@Frequency 1e+6 Hz
Loss Factor; ASTM-D150
 0.0090
@Frequency 1000 Hz
Loss Factor; ASTM-D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 6.40 µm/m-°C
@Temperature 25.0 - 200 °C
ASTM-C372
 7.20 µm/m-°C
@Temperature 25.0 - 500 °C
ASTM-C372
 7.90 µm/m-°C
@Temperature 25.0 - 800 °C
ASTM-C372
 8.20 µm/m-°C
@Temperature 25.0 - 1000 °C
ASTM-C372
Thermal Conductivity 12.0 W/m-K
@Temperature 400 °C
 20.0 W/m-K
@Temperature 100 °C
 26.0 W/m-K
@Temperature 20.0 °C
 
Component Elements PropertiesOriginal ValueComments
Al2O3 96 %
 
Descriptive Properties
ColorWhite
PermeabilityNIL
Surface Finish - (µin.)<0.89as-fired; Profilometer, 0.0002" Radius Stylus, 0.100" Cutoff, ANSI/ASME B46.1
 <35CLA; Profilometer, 0.0002" Radius Stylus, 0.100" Cutoff, ANSI/ASME B46.1

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