Henkel Loctite® ABLESTIK ICP 3535M2 Epoxy

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Henkel Loctite® ABLESTIK ICP 3535M2 Epoxy
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	Appearance: Silver Cure: Heat cure Product Benefits: One component Adhesion stability Electrically conductive Pb-free alternative to solder Excellent reliability on Tin (Sn) terminated components Application: Component assembly, ECA Filler Type: Silver LOCTITE ABLESTIK ICP 3535M2 electrically conductive adhesive is designed for circuit assembly applications. It is specifically recommended for mounting lower cost tin (Sn) finished components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry. This material is designed for applications with small size components (0603, 0402) where no bleeding or wicking is tolerated. This adhesive can be applied by stencil printing. Information provided by Loctite®
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Physical Properties	Original Value	Comments

Viscosity	13600 cP	Increase after 24 hours
	80000 cP @Shear Rate 15.0 1/s	Plate 2 cm @ Shear rate

Mechanical Properties	Original Value	Comments
Shear Strength	4.60 MPa	Tensile Lap

Electrical Properties	Original Value	Comments
Volume Resistivity	0.0020 ohm-cm	Cured

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	150 °C
Minimum Service Temperature, Air	-45.0 °C
Glass Transition Temp, Tg	96.0 °C	Cured, Tan d

Processing Properties	Original Value	Comments
Cure Time	1.00 hour @Temperature 150 °C
	10.0 min @Temperature 175 °C
Shelf Life	6.00 Month @Temperature -40.0 °C

Descriptive Properties
Thixotropic Index	4

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PLOCT5115 / 255326

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