Henkel Loctite® ABLESTIK QMI529HT Paste

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

(Viewing data as-entered. Click here to return)

Henkel Loctite® ABLESTIK QMI529HT Paste
Categories:	Polymer
Material Notes:	Appearance: Silver Filler Type: Silver Cure: Heat cure Product Benefits: Excellent electrical conductivity Excellent thermal conductivity Hydrophobic Stable at high temperatures High resistance to delamination Void-free bondline Excellent adhesive strength High resistance to heat and humidity Good resistance to "popcorning" after exposure to reflow temperatures Application: Die attach Surface Finishes: Copper, Silver-plated copper, Preplated leadframes (Ni/Pd/Au) and Alloy 42 Typical Applications: IC and component attach LOCTITE ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Information provided by Loctite®
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Original Value	Comments

Specific Gravity	4.10 g/cc
Viscosity	18500 cP	Uncured, Speed 5 rpm

Mechanical Properties	Original Value	Comments
Tensile Modulus	3300 MPa	Cured

Electrical Properties	Original Value	Comments
Volume Resistivity	0.000040 ohm-cm	Cured

Thermal Properties	Original Value	Comments
CTE, linear	53.0 µm/m-°C	Cured, Below Tg
	156 µm/m-°C	Cured, Above Tg
Thermal Conductivity	3.50 W/m-K
Glass Transition Temp, Tg	3.30 °C	Cured

Processing Properties	Original Value	Comments
Cure Time	1.167 min	Snap Cure Schedule: (7 Zone) Temp per zone: 170ºC, 170ºC, 170ºC, 200ºC, 200ºC, 200ºC, 200ºC
	1.00 min @Temperature 185 °C	Snap Cure Schedule (Single Zone)
	30.0 min @Temperature 185 °C	Oven Cure
	30.0 min @Temperature 200 - 220 °C	Oven Cure, for higher adhesion
Shelf Life	12.0 Month @Temperature -40.0 °C	Uncured

Descriptive Properties
Extractable Ionic Content (ppm)	<20	Cured, Chloride (Cl-)
	<20	Cured, Potassium (K+)
	<20	Cured, Sodium (Na+)
	<20	Cured, Fluoride (F-)
Pot Life	24 hrs
Shear Strength	21 kg-f	Die, 300 x 300 mil die on Ag/Cu LF @ 245°C
	57 kg-f	Die, 300 x 300 mil die on Ag/Cu LF @ 25°C
Thixotropic Index	4.8	Uncured

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to go back to viewing the property data in MatWeb's normal format.

PLOCT5061 / 255272

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message