Parker Chomerics CHO-FORM 5531 EMI Shielding Material

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Parker Chomerics CHO-FORM 5531 EMI Shielding Material
Categories:	Polymer; Thermoset; Rubber or Thermoset Elastomer (TSE); Silicone
Material Notes:	One component, moisture cure, form-in-place EMI gasketing material. This electrically conductive formulation contains silver-plated copper particles dispersed in a silicone elastomer. It is designed to be robotically dispensed using high pressure dispense equipment. Information provided by Chomerics
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Physical Properties	Original Value	Comments

Specific Gravity	3.20 g/cc	ASTM D792
Deformation	10 %	4 N/cm
	20 %	8 N/cm
	30 %	15 N/cm
	40 %	28 N/cm
	50 %	52 N/cm

Mechanical Properties	Original Value	Comments
Hardness, Shore A	35	ASTM D2240
Tensile Strength at Break	>= 75.0 psi	ASTM D412
Compression Set	40 %	ASTM D395 Method B 22 hrs 85°C
	40 % @Temperature 85.0 °C, Time 79200 sec	ASTM D395 Method B

Electrical Properties	Original Value	Comments
Volume Resistivity	0.0030 ohm-cm	Initial; Chomerics MAT-1002
	0.0040 ohm-cm	Aged; Chomerics MAT-1002
Shielding Effectiveness	52 dB @Frequency 1e+10 Hz	CHO-TP08
	55 dB @Frequency 2.00e+9 Hz	CHO-TP08
	65 dB @Frequency 6.00e+9 Hz	CHO-TP08
	67 dB @Frequency 1e+9 Hz	CHO-TP08
	71 dB @Frequency 2.00e+8 Hz	CHO-TP08

Thermal Properties	Original Value	Comments
Maximum Service Temperature, Air	85.0 °C

Processing Properties	Original Value	Comments
Extrusion Rate	5.50 g/min
Cure Time	4.00 hour @Temperature 22.0 °C	50% RH; Handling Time
	48.0 hour @Temperature 22.0 °C	50% RH; Full Cure
Tack-Free Time	18.0 min @Temperature 22.0 °C	50% RH

Descriptive Properties
Cure Mechanism	Moisture
Filler	Ag/Cu
Resin	One Part Silicone
Time for QC Measurements	8 hrs	Electrical Resistance and Adhesion @ 22°C 50% RH

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PCHOME087 / 28309

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