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Chemically Resistant adhesives

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Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics and many plastics. While its primary use is for potting and encapsulating, it is also an excellent adhesive that forms high strength bonds. EP21AOLV-1 resists a wide range of chemicals including water, oils, fuels and many solvents. The service temperature range for this epoxy is -60°F to +250°F. Other properties include a low coefficient of expansion, excellent dimensional stability, a high modulus and compressive strength. These physical properties combined with good thermal conductivity and electrical insulation make EP21AOLV-1 good for a variety of applications. When used as an encapsulating system, it has convenient handling with a one to one mix ratio by weight or volume. Its ability to flow readily and smoothly is another benefit. The color of Part A is gray; the color of Part B is off-white. EP21AOLV-1 is widely used in the electronic, electro-optical and related industries where excellent heat transfer and electrical insulation are required.

Product Advantages:

  • Convenient mixing: non-critical equal weight or volume ratio.
  • Easy application: readily flowable when potting; brushable when bonding.
  • Versatile cure schedules: ambient temperature cures or fast elevated temperature cures.
  • High bonding strength to a wide variety of substrates.
  • Low coefficient of expansion, low shrinkage and good dimensional stability.
  • Great durability, thermal shock and chemical resistance.
  • Thermal conductivity, over 10 BTU•in/ft2 •hr•°F.
  • Excellent electrical insulation properties.
  • Long working life.

Information provided by MasterBond®

Vendors: Master Bond is a leading manufacturer of adhesives, sealants, coatings and potting compounds. Master Bond’s vast product line consists of over 3,000 epoxy, polyurethane, silicone, cyanoacrylate and latex adhesives that vary in viscosity, cure speed, strength, chemical resistance, electrical properties, etc. Our custom adhesives offer design flexibility and provide excellent bonding performance. Visit www.masterbond.com.

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Physical PropertiesOriginal ValueComments
Viscosity 4000 - 8000 cPPart A
 50000 - 65000 cPPart B
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D >= 80
Tensile Strength at Break >= 5000 psi
@Temperature 23.9 °C
Tensile Modulus >= 450000 psi
@Temperature 23.9 °C
Compressive Strength >= 14000 psi
Shear Strength >= 1100 psiAl/Al, bond
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 1.00e+13 ohm-cm
Dielectric Constant 4.62
@Temperature 25.0 °C
Dielectric Strength >= 400 V/mil
@Thickness 3.17 mm
Dissipation Factor 0.0080
@Frequency 60 Hz,
Temperature 25.0 °C
 
Thermal PropertiesOriginal ValueComments
CTE, linear 22.0 - 25.0 µm/m-°C
Thermal Conductivity >= 10.0 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 250 °F
Minimum Service Temperature, Air -60.0 °F
 
Processing PropertiesOriginal ValueComments
Cure Time 2.00 - 3.00 hour
@Temperature 93.3 °C
 48.0 - 72.0 hour
@Temperature 23.9 °C
Pot Life 90 - 120 min100 gram mass
Shelf Life 6.00 Month
@Temperature 23.9 °C
in original, unopened containers
 
Descriptive Properties
Mixing Ratio (A to B)1:1by weight or volume

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PMASTB307 / 149554

Chemically Resistant adhesives

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