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Elmet Technologies

Momentive Performance Materials SnapSil® TN3085 One-component, thermally conductive, low volatile siloxane, silicone adhesive
Categories: Polymer; Adhesive; Thermoset; Silicone

Material Notes: SnapSil TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature upon exposure to atmospheric moisture. It cures to form an elastic, flame retardant silicone rubber and exhibits Primerless adhesion to many substrates.

Features: Fast tack-free time, Low volatility, Non-corrosive to most metals, Primerless adhesion to many substrates, Low odor cure: releases an alcohol vapor during cure, Thermally conductive, Flame retardant (UL94 V-0, File No. E56745). Potential Applications: Bonding in power supplies, Thermal adhesive between electronic components and heat sinks, Securing PCBs to substrates.

Information provided by Momentive Performance Materials.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.63 g/cc0.0589 lb/in³Cured
 
Chemical PropertiesMetricEnglishComments
Ionic Impurities - Na (Sodium) <= 2.0 ppm<= 2.0 ppmCured
Ionic Impurities - K (Potassium) <= 2.0 ppm<= 2.0 ppmCured
Ionic Impurities - Cl (Chloride) <= 2.0 ppm<= 2.0 ppmCured
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 4646
Tensile Strength 2.30 MPa334 psi
Elongation at Break 150 %150 %
Adhesive Bond Strength 1.30 MPa189 psi
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 4.00e+14 ohm-cm4.00e+14 ohm-cmCured
Dielectric Constant 4.0
@Frequency 60 Hz
4.0
@Frequency 60 Hz
Cured
Dielectric Strength 23.0 kV/mm584 kV/inCured
Dissipation Factor 0.0400.040Cured
 
Thermal PropertiesMetricEnglishComments
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°FCured
 
Processing PropertiesMetricEnglishComments
Processing Temperature 23.0 °C
@Time 259000 sec
73.4 °F
@Time 72.0 hour
Cure as Tested at 50% RH
Cure Time  720 min
@Temperature 10.0 °C
12.0 hour
@Temperature 50.0 °F
1.0 mm cure depth. 30% RH
 720 min
@Temperature 23.0 °C
12.0 hour
@Temperature 73.4 °F
2.0 mm cure depth. 50% RH
 720 min
@Temperature 30.0 °C
12.0 hour
@Temperature 86.0 °F
2.8 mm cure depth. 60% RH
 2880 min
@Temperature 23.0 °C
48.0 hour
@Temperature 73.4 °F
4.0 mm cure depth. 50% RH
 2880 min
@Temperature 30.0 °C
48.0 hour
@Temperature 86.0 °F
4.5 mm cure depth. 60% RH
 2880 min
@Temperature 10.0 °C
48.0 hour
@Temperature 50.0 °F
1.5 mm cure depth. 30% RH
 4320 min
@Temperature 10.0 °C
72.0 hour
@Temperature 50.0 °F
1.9 mm cure depth. 30% RH
 4320 min
@Temperature 23.0 °C
72.0 hour
@Temperature 73.4 °F
5.0 mm cure depth. 50% RH
 4320 min
@Temperature 30.0 °C
72.0 hour
@Temperature 86.0 °F
5.9 mm cure depth. 60% RH
Tack-Free Time 7.00 min0.117 hour
 
Descriptive Properties
Adhesion PerformanceAdhesive failurePolyethylene
 Adhesive failurePolytetrafluoroethylene
 Good (cohesive failure)ABS
 Good (cohesive failure)Acrylic Resin
 Good (cohesive failure)Aluminum
 Good (cohesive failure)Copper
 Good (cohesive failure)Epoxy Resin
 Good (cohesive failure)Glass
 Good (cohesive failure)Nylon
 Good (cohesive failure)PBT
 Good (cohesive failure)PET
 Good (cohesive failure)Phenolic Resin
 Good (cohesive failure)Polycarbonate
 Good (cohesive failure)PPO
 Good (cohesive failure)PPS
 Good (cohesive failure)PVC
 Good (cohesive failure)Steel
AppearanceNon-flowable pasteUncured
 RubberCured
ColorGray/whiteCured
 Gray/whiteUncured
Volatile Siloxane (%wt)0.01Cured

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PMOMEN9906 / 265715

Proto3000 – 3D Engineering Solutions

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